Electronics Forum | Sat May 03 00:58:51 EDT 2003 | ken
Did you check if the height of solder mask between two pads is higher than pads?
Electronics Forum | Tue May 06 06:31:21 EDT 2003 | yukim
The stencil thickness was about 7 mils and was changed to 6 mils.
Electronics Forum | Tue May 06 10:00:06 EDT 2003 | k_h
Got it, thanks, I've always used english mils. Have you solved the problem yet yukim?
Electronics Forum | Fri May 30 11:24:45 EDT 2003 | dsuraski
We also use microns to describe solder paste powder particle sizes.
Electronics Forum | Thu Sep 11 09:22:27 EDT 2003 | swagner
Is there any conceivable way this could cause a tombstoned device?
Electronics Forum | Thu Sep 11 16:50:18 EDT 2003 | davef
Sure it's conceivable that thin HASL can cause tombstoning. Harkening back to the ample discussion in the fine SMTnet Archives, tombstoning is caused by an imbalance in solder surface tension between the two pads of SMT component. The source of thi
Electronics Forum | Thu Jun 02 15:56:42 EDT 2005 | jimmygam
run the board thru both backward and sideways and see what happens
Electronics Forum | Fri Jun 24 15:37:24 EDT 2005 | KT
Also check for any Vian-in-pad designs that could cause the problem.
Electronics Forum | Thu Jul 07 18:07:38 EDT 2005 | saragorcos
Ahh. sorry for the foul up - and thanks for stopping the spread of misinformation!! Sarag
Electronics Forum | Fri Sep 09 12:29:34 EDT 2005 | gregcr
thanks for the tip. Could you clarify what you mean just a bit. Thanks
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