Heller Industries Inc. | https://hellerindustries.com/browse/page/348/
– Reflow Soldering Solder Ball Defects Insufficient Solder Wicking Defects Tombstoning PCB Soldering PCB Bridging Defects PCB Dewetting PCB Nonwetting Circuit Board Voids PCB Delamination Component
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/leadfree.pdf
– No drop-in universal no lead paste – work with vendors is critical – Void formations can be an issue in no leads 5°C - 15°C15°C – 35°C“True” Process Window 230°C – 240°C230°C – 240°CMax PCB Temp 225°C – 235°C205°C - 215°CTypical Peak Temperature Range 216
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/leadfree.pdf
– No drop-in universal no lead paste – work with vendors is critical – Void formations can be an issue in no leads 5°C - 15°C15°C – 35°C“True” Process Window 230°C – 240°C230°C – 240°CMax PCB Temp 225°C – 235°C205°C - 215°CTypical Peak Temperature Range 216
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf
. This paper documents an investigation to determine the impact of voids in BGA and CSP components using thermal cycle testing (-55°C to +125°C) in accordance with the IPC- 9701 specification for tin/lead solder alloys
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/last-will-of-bga-void-1.pdf
. This paper documents an investigation to determine the impact of voids in BGA and CSP components using thermal cycle testing (-55°C to +125°C) in accordance with the IPC- 9701 specification for tin/lead solder alloys
Heller Industries Inc. | https://hellerindustries.com/cpk/
. Each product receives: Positive part identification by P/N, solder paste, baseline profile and product photo Board Level Traceability of Reflow Soldering conditions Recall of all data and parameters for ISO and customer
Heller Industries Inc. | https://hellerindustries.com/convection/
% reduction in nitrogen and electrical consumption! This makes our convection reflow oven machines not only the premier reflow soldering machine system but the best overall reflow oven value in the industry
Heller Industries Inc. | https://hellerindustries.com/convection-reflow/
. Heller’s new heating and cooling advances deliver up to 40% reduction in nitrogen and electrical consumption. This makes the MK 5 system not only the premier reflow soldering machine system but overall the best convection reflow oven value in the industry
| https://www.eptac.com/solder-tips/
: Wave Soldering Insufficient Fill and Voids in PTH There are many reasons for insufficient fill of a PTH (Plated Through Hole) and the occurrence of voids in barrels. Board thickness, finished hole size, board plating material, flux type and application
| https://www.eptac.com/soldertip/soldertip-46-open-connections-found-on-bga-components/
: Wave Soldering Insufficient Fill and Voids in PTH SolderTip #37: Through Hole Soldering of Thick PCBs SolderTip #38: Clean vs No-Clean Fluxes SolderTip #39
