Electronics Forum | Tue Dec 07 20:07:21 EST 1999 | Dave C.
Thanks for all the info Dave. It's the interconnect between the copper foil pad and the eutectic solder ball that I'm most interested in. The BGA in question is very thin gold plated over nickel over the copper. When we are reworking the BGA, i
Electronics Forum | Fri May 01 06:49:31 EDT 2009 | davef
minimum space between selective wave soldering pallet's opening to the nearest PTH or SMT pad? * http://www.agicorp.com/pdf_files/Designguidelines903.pdf * http://www.datumdynamics.com/resources/dfm_wavesolder.html?PHPSESSID=a73b3bc8bbd55519bffbb68
Electronics Forum | Thu Jul 17 17:36:28 EDT 2014 | proy
Hi, > > If you can not rely on your programmer and > the tools he uses then "double checking" can save > you only materials but in time you really do not > save often extend meaning. There are things you > can identify before the stove, but if
Electronics Forum | Fri Dec 03 18:17:12 EST 1999 | Dave F
Dave: There's lots of stuff on the web describing BGAs. Examples are: http://www.smtnet.com/bookstore/publications/0speckdo1/s1.html http://www.smtnet.com/bookstore/publications/0shutcco1/ch1p2.html http://www.citizen-america.com/OEM/bga/process
Electronics Forum | Wed Dec 08 10:10:41 EST 1999 | John Thorup
Hi Dave I think you just provided the key to understanding the problem. By your description you are talking about a CBGA (ceramic). These typically have balls composed of 10/90 Sn/Pb which melts at a higher temperature than the 62/36/2 Sn/Pb/Ag (or
Electronics Forum | Sun Mar 31 10:03:25 EST 2002 | Bob
Cheers Dave, to answer some of your questions. � The component lead is copper with a tin / lead coating. The pads are standard Copper / Nickel / Gold. � The solder is standard Tin / Lead / Silver (2%) We have a lab that can determine the composition
Electronics Forum | Thu Apr 30 22:40:32 EDT 2009 | davef
Selective Wave Soldering DoE to Develop DfM Guidelines for Lead and Pb-Free Assemblies Written by Makram Boulos, Craig Hamilton, Mario Moreno, Ramon Mendez, German Soto and Jessica Herrera Circuits Assembly Magazine, 31 December 2008 19:00
Electronics Forum | Sun Sep 21 15:48:48 EDT 2014 | gascon5383
Our company has a process standard that requires a double person check at the beginning of every run (size of run is irrelevent, whether 20 panels or 500 panels). Every changeover that occurs a first piece inspection is made before reflow. If all is
Electronics Forum | Sat May 08 07:41:00 EDT 1999 | wayne sanita
hello, i have been using up-78 ultraprint for over a year now. at first we were getting lots of solder balls mainly on 0805's. this happened with all paste we used, too much solder under component leads. i have been using apertures reduced 10% homepl
Electronics Forum | Sun May 02 19:09:46 EDT 1999 | JohnW
| | | Ok folk's has anyone used Alpha Metal's UP78 solder paste ? | | | | | | Our place is looking to move to that as the way to go, getting rid of the Hereaus 362's and Alpha 737's of the current set up. | | | | | | My question's are really : | |
