Electronics Forum | Tue Mar 07 08:48:55 EST 2006 | samir
Our ICT Guy here at my company loves to use lots of via holes as test points - via holes which are 0.040" diameter, and spaced at 0.004" edge to edge spacing! He doesn't like to tent the via's either, so I always battle via-to-via shorts at the wave
Electronics Forum | Mon Jan 15 11:41:56 EST 2007 | davef
Questions are: * Does the component take solder when you dip it in the solder pot to test the solderability of the leads? * Can you get full barrel fill when wave soldering a bare board? * Is your flux reaching the top of the board through the hole b
Electronics Forum | Tue Jan 23 10:15:44 EST 2007 | slthomas
J-STD-001C just requires that the area not be so dirty as to contaminate your product, tools, workspace, etc. If you start counting particles, you're into cleanroom territory. Do a search on ISO 14644-1 for specifics. Actually Wikipedia does a ni
Electronics Forum | Fri Apr 06 08:45:48 EDT 2007 | davef
UNDERFILL The design of the component and the end-use environment drive the requirement fot underfill. Here is a good introduction: http://www.asymtek.com/news/articles/2002_globaltronics_csp_and_fcuf.pdf Google for more. We have no relationship, n
Electronics Forum | Wed Apr 21 14:32:52 EDT 2010 | remullis
These ovens maintain good profiling as long as you stay on top of maintenance. I had 4 150's and 1 125. The biggest headache is keep the plenums cleaned (very messy). Also the blower motors have been replaced a few times on them as well. If I were yo
Electronics Forum | Sat Sep 15 00:22:41 EDT 2012 | sarason
The first one I found on Google images. Just a strait search http://www.google.com.au/search?q=Model+SMT-8000&ie=utf-8&oe=utf-8&aq=t&rls=org.mozilla:en-US:official&client=firefox-a Third item down. I used to own a near identical model except tat it h
Electronics Forum | Wed Nov 07 21:36:17 EST 2012 | davef
Multiple process and rework thermal cycles are brutal on boards and components. Improving reliability of products through reducing thermal stress ends-up being a major driver to the interest in lower MP LF solders. Binary LF solders require the addit
Electronics Forum | Fri Feb 22 13:55:27 EST 2019 | bruce_mackean
Is there a need for a simple application to merge a bill of material with the xy placement data into a single (or top/bottom) files for machine programming? ie. add a part number column to the xy data, including "N/A" for parts not found in the BoM?
Electronics Forum | Sun Feb 24 09:13:38 EST 2019 | spoiltforchoice
Look on this forum for a link to SMTMaestro which does just that. Fab3000 is almost there with its BOM tools and has a bunch of handy features, its just that they have not considered this use case instead focusing on recreating the centroid from gerb
Electronics Forum | Mon Apr 08 14:16:29 EDT 2019 | sever_83
We've never heard of seen of such a thing either. We tried a clean sample board and applied con coat. Same process through out and we saw nothing. After speaking with the original operators who was curing the boards he had left the boards much longer
