Electronics Forum | Sat Aug 07 03:35:38 EDT 1999 | JAX
| I am looking for a suppliers' of SMT Terminals on tape and reel to replace TH Terminals used on PCB assemblies. | Dimensions required are approx: | 0.093" high x 0.062" diam. Please contact me for further details. | | Thank you. JA/SR Telecom |
Electronics Forum | Sat Jul 31 13:35:14 EDT 1999 | Miguel Mariscal
| Has anyone done the research on BGA pad size? suppose I have a 0.030" diameter pad as recommended pad size from the spec, what will the minimum pad size allowed? We are laying out a high density board. | If you know what component your'e going to u
Electronics Forum | Wed Jul 28 12:39:22 EDT 1999 | Kenny Vaughn
I have just purchased an EMC CyberClean Series 1000 stencil cleaner(jet spray non-rinsing system). I will be using it to clean misprints, stencils, and residues off of completed prototype assemblies. We are strictly a no-clean process and was looki
Electronics Forum | Fri Jul 23 01:03:28 EDT 1999 | KYUNG SAM PARK
HI Earl Thank you for your answer. Let me know you about the hot you mentioned First of all, The rework machine is the BGA3500 manufactured by 0.k international ] ��DESOLDERING HEAT ��IRON TIP TEMP : 350-370��(MEASURED) ��REBALLING
Electronics Forum | Thu Jul 22 14:44:30 EDT 1999 | Scott McKee
| I am looking for some recommendations for a cleaner for rosin flux. | | James | Popular is an Organic Saponifier Cleaner from Alphametals, the name is 2110. Requires a 5%-7% mix ratio with DI water. IPA is also used but is getting on the "no n
Electronics Forum | Wed Jul 21 19:16:53 EDT 1999 | Dreamsniper
Which among the two profiling method is more reliable/accurate in getting the oven thermal profile? a) using a HIGH-TEMP solder wire then soldering the thermocouples onto the profile points of the board (e.g. component lead etc.) b) not soldering t
Electronics Forum | Tue Jul 20 17:47:28 EDT 1999 | Deon Nungaray
| I recently switched from solder paste in 500 gram jars to 500 gram tubes. I did this to try to limit the time the paste is exposed to the room environment. But we have a need to clean the stencil every 4 - 5 boards which means taking the bulk paste
Electronics Forum | Fri Jul 16 11:29:59 EDT 1999 | John Sims
We are considering adding surface mount components to a board we currently produce. The board is made from CEM-1. Has anyone had any problems with surface mounting to this material? We use a glue/place/cure process. Thanks in advance, John Sims
Electronics Forum | Fri Jul 16 14:36:40 EDT 1999 | ken
Jeff, if you have not already tried this, try a longer, more gradual reflow phase in your profile. This has worked for me to eliminate tombstoning during similar situations where non standard component pads were used. It may provide you a useable a
Electronics Forum | Fri Jul 16 10:57:35 EDT 1999 | Greg Curler
| I need a good chemical to remove the lacquer finish off of magnet wire. I know there are different kinds but I need one that really works. Any suggestions would be great. thanks in advance guys. | Jeff, We use a 725 F Sodium Hydroxide (Caustic So
We are a global electronics manufacturing Solutions provider ....Our company supplies new and used SMT equipment, spare parts, consumibles, ESD supplies and services to a wide range of EMS companies.
Equipment Dealer / Broker / Auctions
Parque Industrial Nogales No. 5297 Zapopan
Jalisco, Mexico
Phone: 523316044491
