Electronics Forum: inspection (Page 125 of 311)

PCB Surface Question - Picture attached

Electronics Forum | Sun Mar 21 08:09:40 EDT 2010 | itzikbs

During PCB bare board inspection we found some deformation on the PCB surface. I appriciate any comment, whom can explain if the boards are problematic or not and whay may casue this phenomena

DEK 265gsx vision calibration

Electronics Forum | Thu Apr 01 23:53:26 EDT 2010 | dekhead

Sounds like SPC data collection is turned on with post print alignment inspection. Needs to be changed to "NONE" http://www.dekhead.com

Ultrasonic detector instead of X-ray

Electronics Forum | Wed Apr 14 14:48:48 EDT 2010 | davef

It won't work. An acoustic signal can't punch through a BGA. The signals reflect at every interface. So, it works for flip chip, but there are too many interfaces in CSP and BGA. Equipment, Inspection, Acoustic microscope * MicroPhotonics * Sonos

Optical Scope for 5mils to 10mils Gap - Is there any Equipment ?

Electronics Forum | Fri May 07 17:12:53 EDT 2010 | hegemon

Is this gap by any chance under a device, like a BGA or LGA? There are several scopes for that type of inspection, if that is what you are describing.

AOI Inspection Process for WS Flux PCB's

Electronics Forum | Fri Jun 25 15:39:57 EDT 2010 | tate350

I'd wash them first then AOI. Especially you use the same AOI for WS and no-clean. You certainly will not want any WS flux left inside teh AOI then use the AOI for a NC PCB...

false call rate calculation AOI

Electronics Forum | Tue Jun 29 11:46:36 EDT 2010 | davef

Prins: Everyone has equations. Here's one some people use: False call rate = [Number of defective boards, but good at inspection]/[Total number of boards produced] Why don't you ask the people [that calculated the numbers that confuse you] how the

I want to learn about bga technology from a pick and place mache

Electronics Forum | Wed Jul 14 16:03:25 EDT 2010 | malcolmlanders

I seemed to have learned that on the bga chip that the soider is the soider balls on the chip. If this is true how do you get the chip to not move on the board when being inspected bdfore you soider it. and even in the transport of the board to the o

Brownish Tint on 0805 components

Electronics Forum | Wed Jul 14 19:23:21 EDT 2010 | davef

So, tell us more ... * Is this at in-bound inspection? Where do you observe this? * Does this affect the whole component, just terminations, ... * Could the 'brownish' be interpreted to be 'purplish'? * How wide-spread is this [eg, multiple products

Omron AOI

Electronics Forum | Fri Aug 20 10:11:19 EDT 2010 | namruht

I just found out that we have an older Omron VT-WIN that we are not using. I do not know anything about the machine, but I am curious if it is worth trying to bring onto the production floor and use it for inspection. Can anyone tell me anything abou

Voiding in LGA (LT) soldering

Electronics Forum | Wed Sep 01 07:44:36 EDT 2010 | sachu_70

Dear SMT-manufacturer, I would recommend to also have other device joints on board X-ray inspected to understand if void formations are seen across the board or confined only to one component. If seen across, your "Reflow Profile" could be the cause


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