Electronics Forum | Thu Jul 03 10:24:54 EDT 2008 | grayman
Hello WaveMaster Larry, I think you are very well knowledgeable in wave machine or process. However, I think the reason why your former company won�t listen to you is because you also never listen to your people. I think you overlooked the saying �N
Electronics Forum | Wed Aug 06 08:09:57 EDT 2008 | davef
We agree that the squigglie part of the section of the BGA ball looks like something other than 'hot tear.' We'd guess that it is an inclusion, but it could be a sectioning defect, as you say. We agree that the majority of occurances of hot tear are
Electronics Forum | Mon Sep 22 17:02:58 EDT 2008 | hegemon
You are on the right track Ismir. Essentially however, as the programmer of the machine, I am the one that creates the PCB with the errors to benchmark the settings for the machine. No secret lab though! :-) Easy enough for most any AOI machine to
Electronics Forum | Wed Oct 29 13:53:52 EDT 2008 | andrew_11
Hello Reese, I had an opportunity to look at the Yestech B3, Mirtec MV-3 and the Landrex Optima. Although I was looking at Desktop AOI Systems, Landrex was very persistent in getting an in line system in front of me at the time. The first machine I
Electronics Forum | Fri Oct 31 12:50:12 EDT 2008 | devgru
Dominik, I have to agree with Andrew on his choice of Inspection Technology, but not the vendor. I looked at 2 of the 3 that you are asking about (TRI did not make my cut as I just didn't get a good feeling from them). I also looked at the Mirtec and
Electronics Forum | Thu Dec 04 09:49:11 EST 2008 | lazzara55
Dear Steven: Often the recommendations for baking prior to assembly are derived from various J-stds. But J's currently concern baking moisture out of components, and fail to address the moisture issues of the PCB. Because of that, there is the IPC D
Electronics Forum | Fri May 01 08:15:36 EDT 2009 | davef
Scavenging Methods [Improve Solder Scavenging of Large Area-array Sites, SMT, Laurence Harvilchuck, process research engineer, Unovis Solutions, harvilch@unovis-solutions.com] Two common methods exist for scavenging residual solder on the site for s
Electronics Forum | Tue Aug 18 17:49:16 EDT 2009 | dyoungquist
Is there a limit to how many times a pcb with components can be run through a reflow oven before the components start to degrade? Example: We load the SMT components on the bottom side of the pcb and run it through the reflow oven. Next we load the
Electronics Forum | Sun Nov 08 10:22:52 EST 2009 | doremi
Hi everybody, First of all, to have process under 100% control you should have AOI after every active process in the pcb assembly line : - Post printing (2D or 3D Solder paste inspection machine); - Post reflow; - Post selective(wave solder). It i
Electronics Forum | Thu Dec 10 19:15:07 EST 2009 | swag
We like to keep one fully populated SMT golden per product (high volume) with t-couples soldered to it. We have best results using high temp. solder to attach t-couples (most permanent). 1) Remove all production solder from the part you are wanting
