Electronics Forum: since (Page 125 of 276)

RELOW PROFILE FOR MIXED LEAD FREE AND STANDARD DEVICES

Electronics Forum | Thu Sep 19 10:15:36 EDT 2013 | sara_pcb

We have a PCB to be populated using reflow soldering. The board contains lead free BGA device(11x11, 1mm pitch ) and Standard SMT devices which are not lead free. Since profile temperature is different for both devices, our contract assembly house is

Fuji Flexa Part Data library sharing

Electronics Forum | Mon Nov 04 12:18:12 EST 2013 | jimmyboz

Its been a couple years since I worked with Flexa every day. The program uses the part number and this should reference some shape library. If you understand the nomenclature of this library, it should get you close. I don't remember if the default

Fuji Flexa Part Data library sharing

Electronics Forum | Mon Nov 04 12:21:03 EST 2013 | jimmyboz

Its been a couple years since I worked with Flexa every day. The program uses the part number and this should reference some shape library. If you understand the nomenclature of this library, it should get you close. I don't remember if the default

Delamination effect in FR1 type PCB (Lead free soldering)

Electronics Forum | Mon Jan 06 17:37:54 EST 2014 | hegemon

Make sure you are providing an adequate moisture bake out prior to wave soldering. It sounds moisture related since is so random. I would suggest perhaps 120C for a minimum of 8 hours to drive the moisture out, and then complete your wave soldering

Underfilled BGA Removal

Electronics Forum | Mon Sep 28 09:23:03 EDT 2015 | slave2anubis

Hi, sorry for reopening a old thread, but i wanted to ask if there is a way to know at what temperature the solder melts if you have a chip with underfill? I thnk its lower then normal air-fill temperature since the underfill conducts heat better the

Underfilled BGA Removal

Electronics Forum | Mon Sep 28 13:03:43 EDT 2015 | dyoungquist

The melting point of the solder itself does not change when you have underfill. If the underfill conducts heat better than air, it will take less heat (and/or less time) from your rework station to get the solder up to the melting point. That makes

Yahoogroup Started for Assembleon Philips Yamaha SMT machine users

Electronics Forum | Sat May 03 10:20:47 EDT 2014 | proy

https://groups.yahoo.com/neo/groups/Assembleon-smt/info See above, I have created a yahoogroup for Assembleon, philips, Yamaha users (a while ago I created a yahoogroup for zevatech and have since moved on, but it is still alive with some 75 active

Thiourea exposure in manual soldering of immersion tin PCBs

Electronics Forum | Sun Jun 01 03:42:49 EDT 2014 | sync40

Hello to everybody in this forum, I would like to know any information that you kindly may have about the following subject: We very often do manual soldering assembly of immersion tin finished PCBs. Since thiourea is used in the formulation of the

Visual Inspection Post Reflow

Electronics Forum | Thu Jul 03 10:10:26 EDT 2014 | jorge_quijano

Hola We do AOI for most of our products, but a few ones goes to visual inspection only... -I have the inspection stations with a magnifier & some with a microscope. -I also use an "inspection mask" which has been very useful, it actually covers the P

too much foam in our Speedline TechnologiesELEOCTROVERT/Aquastorm 200

Electronics Forum | Fri Jul 18 12:16:06 EDT 2014 | island2013

I had the same situation at a facility a few years ago. We moved our wash from one building to another and it was fine for months and then we had the foaming issue similar to yours. We tried everything from adding anti foam agents to even having th


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