Electronics Forum | Wed Sep 08 05:25:10 EDT 2004 | Simon UK
I can only speak for the Fuji, but it is quite possible to get the maximum placement as long as you set the feeders and cut out some of the programming options that slow the machine. But then you may have a line-balancing issue, i know i did.
Electronics Forum | Fri Sep 17 20:29:25 EDT 2004 | fastek
Then you have a problem with the machine. Fix the problem and you will be able to run at the same tact time as when the machine was new.
Electronics Forum | Wed Sep 15 07:43:11 EDT 2004 | gregoryyork
It may be worth baking the boards for an hour at 120C and then trying it straight away do not leave them lying around.Is the fillet shallow and inverted back into the board. Do you have any blow holes as well? Cheers Greg BLT
Electronics Forum | Tue Sep 14 09:32:15 EDT 2004 | gregp
Perhaps your stencil supplier could laser mark the number on the stencil. This only helps from here on. How about engraving the numbers on the stencils you already have? Engravers are pretty inexpensive and shouldn't damage the stencils.
Electronics Forum | Tue Sep 14 09:35:47 EDT 2004 | JB
We have been using SANFORD Gold Coat and are pleased with it so far. It's a meallic marker. Hope it helps.
Electronics Forum | Thu Sep 30 10:59:35 EDT 2004 | John
I super glue a number on the frame and have a excel chart posted with the part numbers and stencil numbers. I had numbers engraved like a name plate on small squares. This work really well. John
Electronics Forum | Tue Sep 14 12:28:55 EDT 2004 | Rob
Hi Simon, Good luck mate. Rob. PS.We try to keep all of the BGA's on side 2, and then glue spot the QFP's & other heavier components that have to go on side 1.
Electronics Forum | Wed Sep 15 22:43:24 EDT 2004 | davef
Just to help convince those on the fence that we don't know dip: 2221A, 4.5.1 tells you the vias have to be tented on both sides.
Electronics Forum | Thu Sep 16 15:01:13 EDT 2004 | russ
You may want to either open up the bottom of the vias so they will not "volcano". Or you will want to seal both sides. It never works having one side of the vias masked and the other open with HASL. Russ
Electronics Forum | Sat Sep 18 08:26:10 EDT 2004 | davef
Carol: If you would have problems both covering the via and keeping mask from the BGA pads, maybe you via are too close to the pads. Maybe some of the IPC pad design guidelines would help.
