Electronics Forum: what (Page 1247 of 1843)

BGA Reflow profiles

Electronics Forum | Mon May 25 04:51:44 EDT 2009 | microdot

hi, we tried making a profile of a chip ATI 9000 mounted on a toshiba laptops, this is on a small pcb. the picture i have enclosed is used to remove the but when we tried to solder the chip using the same profile..it didnt work. Can anybody suggest

OS/2 Warp GSM not playing nice with the network

Electronics Forum | Mon May 18 16:09:37 EDT 2009 | dilogic

I have sucessfully networked our GSM1 into WinXp network using NetBIOS. I was able to access shared folder on the XP server from GSM and we are using that connection for backups and new product imports. Our machine runs on OS/2 V2.11, but I think tha

SMT placement machines. Where are we going ?

Electronics Forum | Mon May 25 08:30:48 EDT 2009 | cyber_wolf

I assure you this is no add. I have posted on here for years, and NO we do not recieve benefit from Juki. I am just a technical guy that has worked in the trenches every day with various pick and place machines over the years. Let me re-state that I

SMT placement machines. Where are we going ?

Electronics Forum | Tue Jun 02 22:32:09 EDT 2009 | mikehe

I can tell you from current experience that the Sony and Assembleon machines are bullet proof. I just placed 0201's on the Sony G200 and ran it at wide open throttle and it didn't skip a beat. You have to keep in mind that the speed ratings that the

Component classification - What is Class 1,2,3?

Electronics Forum | Thu Jun 04 17:32:20 EDT 2009 | bigdaddysoy9

If you are talking about assemblies, Class 1 is like cheap toys or something you wouldn't expect to last very long. Class 2 would be components for a television, air conditioner, automobile (except safety critical). Basically, things that you would b

Bad solder joints

Electronics Forum | Mon Jun 01 17:41:20 EDT 2009 | gregoryyork

What is your squeegee pressure and size. Also does the pad sit on a ground plane, as it looks like it is partially reflowed so surface has gone but not coallesced properly which would indicate it is more a problem with reflow above 217-219C OR obviou

BGA flux dipping process

Electronics Forum | Tue Jun 02 22:19:17 EDT 2009 | mikehe

We have been doing BGA's for years now, and I would suggest updating your profile and place a thermal couple on the BGA, keep in mind the bigger the part the more heat it will need, We stencil print all of BGA's from simple bga's to complex ones, you

Conductive Corrugated Boxes

Electronics Forum | Wed Jun 10 09:43:21 EDT 2009 | rway

I don't know exactly what you are saying about the configuration of the shipping container, but as long as the pcbs are seperated from the inside non-conductive box, it's fine. The pcbs touching the conductive corrugated box won't hurt anything. Th

Conformal Coating Equipment - Where to Start?

Electronics Forum | Fri Jun 12 13:06:14 EDT 2009 | grizzy

We have an excellent machine from a leading manufacturer of Conformal Coating equipment..... USI. This machine can run relatively high volume applications, and is in line, smema controlled. I suggest you watch the video of our machine in operation, a

BGA Pad Cratering

Electronics Forum | Fri Jun 05 16:06:51 EDT 2009 | mjz289

This is from a section of an ALtera EP2SGX130-5 STRATIX 2 leadfree 1,508 ball BGA. What can be causing this? It is from an unused board (not assembled in a unit, or in the field, but it did pass electrical and function test. There are three of them i


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