Electronics Forum | Wed Feb 02 18:01:22 EST 2005 | russ
I would call it conservative, but definitely recommended. It sort of depends on your assembly design. We have run 140 boards lead free but are now using the 170. Russ
Electronics Forum | Mon Mar 07 15:35:35 EST 2005 | John M
It has been my experience that the standard Fr4 material (Tg 135c) will discolor when processed at the new higher temperatures required for the high tin alloys... We have been using the High Tg Fr4 (Tg 170c) for many years to ensure this does not hap
Electronics Forum | Wed Feb 02 16:24:14 EST 2005 | bobsavenger
I would like to know if anyone has an IPC specification for BGA's handy? I'm looking for specifics based on Classification. Roundness, %voids, size, etc. Please let me know if you have this. Thanks Bob
Electronics Forum | Sun Feb 06 12:59:33 EST 2005 | GC
Please try to use 6-8 mils ..you are overloading pads surface ..Please verify paste volume vs surface..Have fun
Electronics Forum | Tue Feb 08 06:43:56 EST 2005 | dhanashekar
we have even tried with 6mil stencil even than we are getting the solder ball thanks for your suggestion
Electronics Forum | Tue Feb 08 10:33:26 EST 2005 | Dougs
have you had any reduction in aperture size though, we generally use a 6 mil stencil thickness with a 10% aperture size reduction for chip components and leaded components ( SOIC - QFP ) and a 1:1 ratio for BGA components without any problems.
Electronics Forum | Mon Feb 07 21:28:42 EST 2005 | Grant
Hi, That link above points to a weird forum, and I have no idea how to use it. Was there any reply to the original post on that forum? Some posts here on it would be good. Regards, Grant
Electronics Forum | Tue Feb 08 11:14:45 EST 2005 | George
Have a customer that needs to find someone that can do Chip on board Wire bonding automated only. You folks know of anyone? We are in the Newengland Area. You know, where the Patriots reside?
Electronics Forum | Wed Feb 09 11:13:33 EST 2005 | mrduckmann2000
Russ, Are you placing 0402's on glue by using a stenil at present? I am afraid the appertures will be too small for the glue to release from the stencil. Are you having any issues with this? Thank you for the reply. Mike
Electronics Forum | Wed Feb 09 16:33:53 EST 2005 | davef
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