Electronics Forum: having (Page 1250 of 3489)

Conformal Coating BGA's

Electronics Forum | Wed Jan 12 09:08:33 EST 2005 | carobin

I was looking to see how others are handling conformal coating PCBs containing BGAs. We have looked at underfills, but none meet the reworkability we need.

Trouble with wave solder pallet

Electronics Forum | Wed Jan 12 16:11:26 EST 2005 | russ

I have seen the solder shoot out at least 4"-6" from both the leading and trailing edge when this happens. If the open pockets are real deep you may want to use a turbulent/chip wave for soldering, sometimes this leaves bridges however.

Automated Labeling for SMT Assembly

Electronics Forum | Thu Jan 13 13:15:47 EST 2005 | msjohnston1

I'm looking to automate my PCB labeling. Anyone have any insight (especially first-hand users) into this type of system?

Automated Labeling for SMT Assembly

Electronics Forum | Thu Jan 13 15:35:14 EST 2005 | clarkk

Mike, I have a used Computype machine that pulls labels from a printer and installs them on the pcb. I can send you pictures and copies of the specs from the manual if you like. Best regards, Clark

Best Land Pattern design for 0402 Resitors?

Electronics Forum | Fri Jan 14 12:59:07 EST 2005 | Dan Mendoza

I have used the rectangle shapes and round shapes with no noticible difference. The idea is to design the pads to accept the same solder volume per component. Components over two size pads will favor the higher solder volume side during reflow.

Lead free component on leaded process

Electronics Forum | Fri Jan 14 21:44:52 EST 2005 | Chua

Hi, I have component like QFP and connector which is lead free component. And now the process still is leaded process. Pls advise whether I can use the lead free QFP and connector on leaded process. Appreciate the help.....

Lead free component on leaded process

Electronics Forum | Sat Jan 15 10:45:04 EST 2005 | Brad

HI, I actually have ask the same question a while back. Yes, using lead free component in a leaded process should be no problem at all. May required just a little hotter peak temp. during reflow, to achive optimal solderability.

Lead free component on leaded process

Electronics Forum | Mon Jan 17 09:02:27 EST 2005 | russ

I have found that with the TI ni/pd platings that a peak temp of 226 C is the best for joint strength. Russ

Surface mount Machines

Electronics Forum | Tue Jan 25 12:59:53 EST 2005 | Andrew Smith

Brad, You may want to give some of my customers a call in reference to the Assembleon machines. The newer style of P&P have windows NT which is much user friendly than the earlier generation. You can always drop a line back if your interested in

Lead Free Reflow

Electronics Forum | Wed Jan 19 18:24:09 EST 2005 | russ

Make sure that you are running the right leadfree profile. You may want to verify that it is correct with thermocouples. Use Indiums Tacflux023, This should work. As far as cleaning them after this I will have to leave up to you. Russ


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