Electronics Forum | Tue Jan 16 07:02:47 EST 2001 | You Kim Huat
HI, Can someone advice me, is there any guideline to determince the opening for stencil during stencil fabrication. Also is there any method to determince whether the solder paste amount is enough during this process.
Electronics Forum | Tue Jan 16 07:07:03 EST 2001 | You Kim Huat
HI, Can someone advice me, is there any guideline to determince the opening for stencil during stencil fabrication. Also is there any method to determince whether the solder paste amount is enough during this process.
Electronics Forum | Tue Jan 16 21:00:11 EST 2001 | davef
Two good sources of information are: 1 IPC-7525 Stencil Design Guidelines 2 SMTnet fine Archives [once the guys get them back up and running after the conversion is complete]
Electronics Forum | Wed Jan 17 03:06:56 EST 2001 | George English
You can try : Optimum pad design and solder joint shape for reliability. written for the NPL(England) by Milos Dusek and Chis Hunt, (good ol' English names !!) or of course the IPC guidelines IPC-7525 Regards G
Electronics Forum | Tue Jan 16 13:48:51 EST 2001 | cebukid
...but with this new version of SMTNet, none of the links on archived messages work!!! It keeps saying "parameter incorrect."
Electronics Forum | Wed Jan 17 08:33:29 EST 2001 | cebukid
I'm using Netscape browser. When I click on the archive links, it opens another window which says "parameter incorrect."
Electronics Forum | Mon Jan 22 21:30:41 EST 2001 | dason_c
I had my experience when I run the Motorola BGA and I am not sure the voiding was created due to the incompatible flux residue. Rgds. Dason.
Electronics Forum | Mon Jan 22 22:37:27 EST 2001 | davef
50 ppm oxygen was on half joints reflowed in air. 3d Human factors PCB pad cleanliness: Handling of bare board pads creates excessive voiding. Print rejection: Cleaning of OSP pads with acetone or isopropanol increases voiding.
Electronics Forum | Thu May 03 17:34:57 EDT 2001 | oscar mendez
Does any one experienced problems on BGA voids related to height of chip (placement), and also another question, Does any one has some statistical process control for the BGA soldering process? if the answer is yes, I'd like to have advice from you.
Electronics Forum | Mon Jan 22 21:24:33 EST 2001 | edger_w
Hi! Mike My company is using the electric dry box and it can controlled less than 10% within 2.5 hours if we are not going to open the door. In normal working environment and it still can't control around 30%. Is it something that you are looking
