Electronics Forum | Tue Nov 12 13:03:38 EST 2019 | alexeyzb
Some problem with screen printer process. You need to show photo of defect for understanding.
Electronics Forum | Thu Aug 31 09:13:13 EDT 2023 | tommy_magyar
Is there any outcome?
Electronics Forum | Fri May 29 15:17:14 EDT 1998 | Ryan
| Thanks Steve- Here is the whole story: The solder balls are appearing all over, similar to a splatter. They are relatively small. We are using H-Technologies S-HQ no-clean solder paste. The stencil is 6 mil and the boards are running in a ABW
Electronics Forum | Tue Dec 07 20:07:21 EST 1999 | Dave C.
Thanks for all the info Dave. It's the interconnect between the copper foil pad and the eutectic solder ball that I'm most interested in. The BGA in question is very thin gold plated over nickel over the copper. When we are reworking the BGA, i
Electronics Forum | Mon Dec 17 11:20:12 EST 2001 | slthomas
Well, I was able to convince them we had a serious problem on the poorly reflowed boards without spending 2k on off- site analysis. Now all we have to do is sort out the ones that flowed well but had solder balls (looks like a damaged stencil prob
Electronics Forum | Thu Feb 21 13:08:06 EST 2002 | vincent_f
Hello, I had recently a problem of crack between the solder ball (SnPb) and the Ni layer of the PCB pad. We use Electroless Ni/Au technology for PCB. This phenomena is amazing because the crack is very clean (straight) and it creates a space betwee
Electronics Forum | Fri Sep 30 19:14:35 EDT 2005 | DasonC
The stencil is 5 mil thick and the aperture is 12 mil sq. We found open but can't detect by x-ray. The process which we are using is no clean TIN/LEAD. Just thinking the ball size variance from 0.35~0.45mm per IPC-7095, in worst case scenarios, th
Electronics Forum | Mon Jan 16 09:15:40 EST 2006 | russ
I can't see why it would be any different, You are melting the balls into reflow to the pad. In my opinion, paste is only useful in this situation to keep the part on the board during placement along with some planarity concerns in some instances.
Electronics Forum | Tue Jan 17 11:19:34 EST 2006 | Kris
Amol, RoHS does not apply to BGA on their own. Depends where they go in ? DVD player vs server board There is "solder exemption" for certain product applications. SnPb ball BGA can used with tin-lead solder on server/infrastructure/switch telecom
Electronics Forum | Fri Mar 23 15:33:53 EDT 2007 | ppcbs
Does anyone know where to purchase 90/10 & Lead Free solder balls and kits for BGA Reballing? I'm having service problems with my current vendor who decided that they no longer wish to sell 90/10 balls, can't take in an order without a quote, and ca
