Electronics Forum: any (Page 1270 of 1647)

lousy wetting of 0805 film caps

Electronics Forum | Thu Aug 23 15:45:48 EDT 2001 | slthomas

So, we've already addressed the tombstoning on these guys by adopting the mfr's (Pana.) recommendations for pad size and spacing. Problem is, we have pretty bad wetting of some of these parts. The rest of the board we use them on looks great, nice

Quality control

Electronics Forum | Mon Aug 27 16:13:35 EDT 2001 | seand

Hello Everyone, For QC purposes, there are a couple of methods to both qaulitatively and quantitatively inspect your manufacturing process. For Paste inspcetion, an inline machine like the SE300 by CyberOptics may be appropriate. You may also inco

Stencil Inspection Equipment

Electronics Forum | Wed Aug 29 20:20:19 EDT 2001 | Rob Fischer

What a great question! I know of just a couple: http://www.scancad.com http://www.lpkfusa.com/products/product/smtstencil/index.htm They've been around for awhile and must have a proven track record. I don't know if there is any governmental agency

What pressure is recommended to clean AMT boards after reflow

Electronics Forum | Fri Sep 07 15:17:01 EDT 2001 | seand

Hello Everyone, Speedline Technologies' Electrovert Division does offer a number of batch and in-line systems for your cleaning application. A good contact for you to reach to discuss the details of your application would be Bill Boyde at the facto

parts popping off during reflow

Electronics Forum | Fri Sep 28 09:30:07 EDT 2001 | kmorris

Just had a similar phenomenon 2 days ago. May relate to your issue --- or not. Like you, I did a once over looking for mechanical obstruction & couldn't find any. Ran a thermal profile on the offending PCB & all checked out. Looked in end of oven

Dek compared to MPM

Electronics Forum | Tue Sep 18 15:28:56 EDT 2001 | jschake

This is an interesting dilemma you have been faced with. If both machines are outfitted similarly and running under identical process settings then they should produce nearly the same results, in theory. I do not dispute the observations you are re

Inspection Equipment

Electronics Forum | Thu Sep 27 11:59:14 EDT 2001 | vance

Programming time is going to be your biggest concern with a high mix environment. This includes maintaining programs. Any time a part's appearance changes (color, location of marking, wording, etc) templates need to be modified in some way to produ

CAD viewers, API

Electronics Forum | Tue Oct 02 22:13:56 EDT 2001 | davef

IPC-D-356 is a data transfer language developed by the IPC to replace Gerber. It is a far more intelligent form of physical definition for PCB/PWB. The only segment of the language that seems to have developed any market support is the physical netl

Reflow Oven

Electronics Forum | Fri Oct 05 08:35:52 EDT 2001 | Hussman

Hey Steven, Achieving the proper profile like you described does require you to engineer proper conveyor speeds and zone temps. Most conveyorized ovens have the inside of the ovens divided into zones. Each zone has a top and bottom heater that can

672 PBGA on PC Card .015 thick pcb

Electronics Forum | Mon Oct 08 23:17:48 EDT 2001 | Brad Arnold

We are trying to produce a PC Card bus assembly with a 672 pin BGA on one side. These pcb's are .015 thick. I believe the ball pitch is .5mm. The pcb's are plated with white tin. The pcb's are in a 1 X 3 array. We had 2 plates with appropriate cutout


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