Electronics Forum | Wed Jan 14 12:38:59 EST 2004 | Chris Lampron
Good Day, I have had a similar situation with a QFP. It turns out that the PCB HASL finish was too thin causing oxidation on the copper. The problem was only evident on the QFP as this part had the smallest deposition of paste (and therefore, flux)
Electronics Forum | Thu Feb 05 15:12:58 EST 2004 | pjc
There is the IPC/JEDEC J-STD-033 that addresses moisture sensitive components. Go to http://www.ipc.org for the standard. Your factory/storage area environment will dictate exposure times allowable. Be mindful of temperature and humidity changes- lik
Electronics Forum | Fri Apr 02 01:10:01 EST 2004 | Grant Petty
Hi, We tried that, as the Soltec has a spray fluxer that can flux just the connector part of the board, however we get really heavy solder deposits on the rest of the board that has no flux sprayed on it, so we seem to need to coat the entire board.
Electronics Forum | Wed Apr 07 08:28:41 EDT 2004 | Dougie
Hi, We are Scottish manufacturing company considering a move to Immersion Silver finished PWB's from HASL. The driver behind it being the RoHS and WEEE legislation in Europe at present. My question is... We plan on using a Sn/Cu/Ni solder bar in o
Electronics Forum | Wed Apr 07 08:30:22 EDT 2004 | Dougie
Hi, We are Scottish manufacturing company considering a move to Immersion Silver finished PWB's from HASL. The driver behind it being the RoHS and WEEE legislation in Europe at present. My question is... We plan on using a Sn/Cu/Ni solder bar in o
Electronics Forum | Tue May 25 10:16:03 EDT 2004 | Bimal Patel
We are doing assemblies using Immersion Silver coating for RF assembly for a while now. We did not have problem using 63/37 SN/PB solder paste untill recently. We started seeing black marks on the finish and around the solder joint recently. We have
Electronics Forum | Tue May 25 10:16:07 EDT 2004 | Bimal Patel
We are doing assemblies using Immersion Silver coating for RF assembly for a while now. We did not have problem using 63/37 SN/PB solder paste untill recently. We started seeing black marks on the finish and around the solder joint recently. We have
Electronics Forum | Wed May 26 03:04:09 EDT 2004 | johnwnz
Mark, that would be a good report to have a look at can you post it on the site or mail it out to me? Also I've been having an issue with blue peelable solder mask on silver boards where it peels the silver off with it. I've only seen this since my v
Electronics Forum | Fri May 14 12:40:03 EDT 2004 | Kuru
My switch is good, I can check the switch and the two photo sensors on the input test screen. They are turning on and off.I can see it no the board too. When I start up I can see Tactile unit come down so I know pneumatics portion is good. I am still
Electronics Forum | Tue Jun 01 07:18:15 EDT 2004 | johnwnz
Abraham, it kinda depends on your BGA ball size, device height. The probem is that very few machines will manage to get cleanign fluid under a BGA and you certainly will struggle to get it dry. You would need to look at various supponofiers as well.
