Electronics Forum | Tue May 21 06:33:37 EDT 2002 | hayashi
*the other components are 0402 and SOIC 16, the > solderability were good. *the protection on the > terminations of microleadframe package is > Cu(copper),somebody call that leadless leadframe > package(LLP). *the time above 210 deg C is about
Electronics Forum | Wed May 22 21:01:49 EDT 2002 | davef
Ah, the customer is always correct, again. And you are officially �painted into a corner�. Actually, your customer is not correct. Thinking that money is going to be saved by specifying copper component terminations [or whatever in the world they
Electronics Forum | Wed May 22 08:43:40 EDT 2002 | pjc
I have experience cleaning NC for military boards. The reason for cleaning the NC is due to conformal coating requirements. Zestron Vigon A200 and Atron AC 100, as well as Petroferm Hydrex DX have both been effective at cleaning Alpha UP78 NC paste.
Electronics Forum | Fri Jun 14 09:15:02 EDT 2002 | edahi
DaveF, Yeah you got that right...because the initial stages of the project, the products would only attach 1 passive (capacitor) hell when things got too cheesy they wanted to attach 20 caps or so....this is not like board assembly, this only 1 Flip
Electronics Forum | Fri Jun 21 15:04:51 EDT 2002 | bentzen
Hi Greg. FujiCam has two ways of calculating the placement coordinate for a component. - The "FujiCam/Unicam way": calculating component origo as the center of the designed component pads. - Use the PCB designers part origo which could be center of
Electronics Forum | Wed Jul 17 11:45:48 EDT 2002 | fmonette
The current IPC/JEDEC standard J-STD-033 for moisture-sensitive devices does not include a bake cycle at 90C (it includes cycles at 40C and 125C for non-assembled components in reels or trays). However, the upcoming revision, which should be release
Electronics Forum | Sat Aug 17 07:34:36 EDT 2002 | bentzen
Hi Ken First of all, I think you are right to point out that the uptime should be calculated on the SMD line bottleneck. But I have some comments to your posting in general: The SMD line bottleneck, you say, is always the palcement machine. This i
Electronics Forum | Wed Aug 21 14:11:13 EDT 2002 | kenbliss
Hey dragonslayr Just a follow up comment from your comments that you fail to see the significance to the value of the assembly. My point was that if the board is worth say 100.00 cost and you built 100 per day and 2 per day require manually rework
Electronics Forum | Tue Aug 27 22:07:45 EDT 2002 | davef
Pad. Land. A portion of a conductive pattern used as a termination area. Metal surrounding a hole on a printed circuit board. Mask. A material applied to allow selective etching, plating, or protection of the surface of a printed circuit board.
Electronics Forum | Mon Sep 23 12:58:13 EDT 2002 | dragonslayr
Methusala was very old yet he is still talked about thousands of years later. In my perspective, age of a thread is not the issue. It is the careless resurrection of a non-active subject that causes waste of time and space that is the issue. I can
