Electronics Forum | Mon Sep 23 14:08:38 EDT 2002 | rocco
Hello My question is if the diferent types of allows that components manufacturers have considered like SnAg,SnCu,SnBi,NiPd,etc for platings instead Pb Have special handling at storage,floor handling and re-using as well as reworking ... Consideri
Electronics Forum | Tue Sep 24 12:30:11 EDT 2002 | Claude_Couture
I'm just shooting ideas here, but maybe a via hole in the middle of the solder pad would drain the excess solder by capillary force? Or using a tin plated PCB and printing flux only, then place and reflow. depending on the thickness of the tin plati
Electronics Forum | Fri Sep 27 13:53:27 EDT 2002 | pr
We used it only for operator verification of placement accuracy, your boardhouse should be able to show you examples of what they look like. They basically outline the outside edge (corner)of the part so you have a visual, after placement (since you
Electronics Forum | Wed Oct 09 08:51:34 EDT 2002 | pjc
No, wouldn't want to, wouldn't be prudent. Best process I think is to solderpaste reflow the TSOP components then mask them for the wave. Mask using liquid type soldermask or a selective solder pallet. Or, if you must, the only way I can see any dece
Electronics Forum | Fri Oct 04 12:02:53 EDT 2002 | mzaboogie
Hi Barry, One consideration that you may want to consider is the lead to hole ratio. The higher the ratio, the less solder is required to fill in the gaps and give you a fillet. Heat is a concern. You will need to ensure components will take the he
Electronics Forum | Tue Oct 01 16:50:26 EDT 2002 | dragonslayr
Just checked the archives with no real success so I am asking here. Are there recommended no clean pastes for SMT reflow of BGA's? Seems to me in recent threads a pro and con issue of whether or not to use no clean for BGA's is raised. The BGA in
Electronics Forum | Fri Oct 04 11:25:49 EDT 2002 | Bob Willis
If you want some additional material on 0201 design and assembly the SMART Group Committee produced one of its Charity Reports with all the money raised going to the Red Cross USA September 11th Appeal. You can get it from the SMTA Main office, it fe
Electronics Forum | Wed Oct 09 17:50:09 EDT 2002 | alj
Wrong..! It is a money loser for Teradyne and it will be cut in the future. Wow, auto thermal profiling.. Gee, that is a little late. When will the summit platform be redesigned. It's the same thing they sold 10 years ago with a few modificati
Electronics Forum | Tue Oct 15 15:51:21 EDT 2002 | dragonslayr
Brian - a recent thread (early September) instigated by yours truly postulated on the "deep fried twinkie" experience. It seems to be a trend at the local county and Sate fair circuit. I hear rumors it all got started in Texas. I have actually tasted
Electronics Forum | Fri Oct 11 17:19:23 EDT 2002 | peterson
The ASG (Tyco) MEP (Manual Electric Press) or the AEP (Automatic Electric Press) are both excellent machines, we have used them successfully on all types of press fit connectors. Give Dante Parenti a call and he can help you out. (215) 784 4530 Or g
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