Electronics Forum: assembler (Page 129 of 598)

cost effective bga remove

Electronics Forum | Tue Mar 09 09:22:40 EST 2004 | Tobias

Hello, i'm searching for a way to remove bga's easy and cost effective. It doesn't matter if the PCB or adjacent assemblies are damaged. Thanks!

VAPOUR DEGREASING

Electronics Forum | Thu Mar 18 02:52:31 EST 2004 | Sam

Mike we make electronics assemblies for military and commercial aircraft sector. We are genrally looking at cleaning populated printed circuit boards. Sam.

Ionic washing

Electronics Forum | Thu Mar 18 20:37:35 EST 2004 | davef

Water wash cleaning with a deionized water rise is used for bare boards and assemblies [and probably components also, but we're not sure]. Look here for the basics: http://www.circuitree.com/CDA/ArticleInformation/features/BNP__Features__Item/0,2133

AMP SMT Connector

Electronics Forum | Tue Apr 13 07:06:31 EDT 2004 | Chris Lampron

Hi Steve, Could it possibly be a coplanarity problem? I have assembled hundreds of SMT connectors at a Flex house and we found quite a few coplanarity issues. In many occurances, the connector showed symtoms that you are describing. Good Luck Chri

depanelisation of IMS board

Electronics Forum | Wed Mar 31 01:25:16 EST 2004 | amil

dear all, we prepare ourself to assembly IMS board The PCB design with V cut How to depanelisy it? With scoring machine or manual breaking? Any experience Thanks G�bor

Immersion Silver Reliability

Electronics Forum | Tue Apr 20 17:19:38 EDT 2004 | Mike

1. Which manufacturers have proven the immersion silver is reliable after solder joint assembly? 2. Who has published guidelines for storing and handling immersion silver boards? 3. Is the immersion silver finish wire bondable? epoxy bondable? or j

smt basics

Electronics Forum | Thu Apr 29 07:21:00 EDT 2004 | Claude_Couture

Depends how much money you have in your budget. You have to break down your assembly into the different components and figure out what can be done by machine and what can't. Then search for machine that can do the jobs. There are consultant firms tha

LSP profile

Electronics Forum | Mon Jun 07 22:05:58 EDT 2004 | Ken

Me too. Check out this months Circuits Assembly. Dage has an interesting article about voiding as a function of surface plating....

Automate Through hole assembly

Electronics Forum | Wed Jun 30 16:17:28 EDT 2004 | mdang

Thank you very much for everyone information. It 's really help. I will do some more research and respond it. Thanks, -Michael

Electromigration Testing

Electronics Forum | Wed Sep 15 17:13:53 EDT 2004 | GS

Do anyone of you know if are there any Standard (IPC, JEDEC, etc) telling how much can be the acceptable level of TIC (ugr/cm2 NaCl equivalent) allowed on surace of Connectors, Components,before to be assembled on PCB ? Many thanks Rgds GS


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