Electronics Forum | Wed Feb 21 20:40:44 EST 2001 | jagman
I appreciate both of your responses. I spoke with a tech rep at a distributor of the Loctite 3609 and asked him if this adhesive can be cured using a bake oven (Blue M, Despatch, etc.), rather than convection/IR. He stated that he's never heard of
Electronics Forum | Mon Feb 26 12:26:43 EST 2001 | CAM
I'm working a problem and looking for your input. Here the deal: Two sided mix technology board. Test is using unmasked via points on bottom for test points. Our fab drawing states tent via points on top side. First set of board came in with no tenti
Electronics Forum | Tue Feb 27 03:35:23 EST 2001 | peterbarton
Steve, I have to support the comments made by Dave F. Provided the surface mount parts on the second side are correctly orientated and not too close to any adjacent through hole leads then the best option has to be to print glue then wave solder. T
Electronics Forum | Fri Apr 20 11:07:52 EDT 2001 | kawiederhold
Hi Dave, Good to "talk" to ya again!! I have attached a photo of the antenna. Hopefully it will work its way through the system. The pictured antenna meets all our criteria. The defective antennae all seem to slide toward the center of the PCB (
Electronics Forum | Tue Apr 24 08:31:36 EDT 2001 | davef
First, you found THE place already!!! Read the Archives, current and previous Newsletters, technical papers, terms & definitions, etc Second, magazines ... Assembly magazines http://smt.pennnet.com/home.cfm http://www.cassembly.com/ http://www.ep
Electronics Forum | Thu May 03 09:55:36 EDT 2001 | davef
First place: Try Genrad, but you probably have a good story why you don't want to do that, eh? Second place: Try an used ATE reseller / refurbisher like: * Denver Test Systems 12253 E Alaska Pl Aurura, CO 80012 303 341 7566 fax 0378 Karol Shure
Electronics Forum | Mon May 14 19:16:49 EDT 2001 | jagman
Dave: Actually, I'm located in the South Bay (Santa Clara)! Good guess. Now, for more in-depth information: So far, the distribution has been limited to one board out of 10 assembled, so far from one lot. The components assembled are exclusively
Electronics Forum | Mon May 14 14:51:36 EDT 2001 | Brian W.
Personally, I prefer the OSP. I get a flat surface to deposit paste on, resulting in more consistent solder paste volumes. With HASL, the amount of plating and the mounding affect the paste deposition. I have even had it affect the placement. The
Electronics Forum | Tue Jun 26 22:52:27 EDT 2001 | ianchan
I second that juicy bit from brownsj, Sn96/Ag4 process is what we are using too, currently for BIB runs, dunno about current capital investments needs, coz from what I understand, our company's BIB pioneer guy, personally designed the machines in cur
Electronics Forum | Mon Jun 25 11:09:26 EDT 2001 | wbu
Who is this, another Dave F ? For me there�s no problem with balling and beading. I know that the boards I have with the new paste do have all what�s needed for balling and beading, just one of the oldest designs with a stencil ...., oh boy, didn�t
