Electronics Forum | Mon Dec 11 15:50:01 EST 2000 | externet
Hi ! Try fresh DRY solder paste... Keep solder paste in a sealed container until the moment of use. Humidity absorbed by the soldering paste becomes vapor violently at the moment of heating it , expelling the solder in form of balls everywhere.
Electronics Forum | Sat Jan 16 03:06:36 EST 1999 | Wirat S.
| | Our spec on voids is 30% ball diameter in the center. On the component to ball and pad to ball interface, we use 25%. To determine this spec, we asked around. I don't know of any studies that have been done to verify if this is OK | | | | Regard
Electronics Forum | Tue Feb 03 06:52:45 EST 2004 | paul_bmc
About 2 years ago our company tried to go with a post reflow AOI inspection. This AOI was suppose to be able to inspect to a level class 3 product. **It is impossible** You cannot inspect for a heel fillet and inspecting for poor wetting is a very
Electronics Forum | Wed Apr 21 20:50:26 EDT 1999 | Dave F
| I'm having problems with trying to get a good solder joint using a Ceramic PCB. We are using AMTECH hi-temp solder (ws-486 96.5/3.5ag). My profile looks great and I used the recommended profile from Amtech with a few adjustments. My max temp is abo
Electronics Forum | Thu Jun 28 10:46:44 EDT 2001 | genny
Thank you. I'm sorry if I came across frustrated or anything, but I wasn't sure if people were ignoring the one question I kept asking or if, as you said, they just didn't know. Here's the deal. We are a small company rapidly growing into a larger
Electronics Forum | Mon Dec 22 15:35:18 EST 2003 | davef
Marc: Please be more explicit. * When you say, "parts have a metal shell"; are you talking about the component leads or the component body? What is the metal, what is it appearance, and what are it's implications? * When you say, "the parts have a
Electronics Forum | Mon Dec 11 15:12:20 EST 2000 | accuspec
we are using alphametals no clean 95sn/5ag CL775 paste. After reflow there are solder balls on the board. mainly are around the cap. We are using a conceptronic concept 60 air. There are 4 zones with 8 chambers. We are not sure what the profile
Electronics Forum | Fri Oct 29 05:23:00 EDT 1999 | Wolfgang Busko
Hi Bart, that�s much to high. If that would happen to me my boss would tear my head off. For improving the yields you must find the cause for the soldering problems. What are the symptoms? What could be the cause for the symptoms? Could be design pr
Electronics Forum | Wed Apr 21 22:15:12 EDT 1999 | Chris
| I'm having problems with trying to get a good solder joint using a Ceramic PCB. We are using AMTECH hi-temp solder (ws-486 96.5/3.5ag). My profile looks great and I used the recommended profile from Amtech with a few adjustments. My max temp is abo
Electronics Forum | Thu Oct 31 12:33:14 EDT 2013 | pbarton
You should have no difficulty with QFN or QFP parts when using non-RoHS solder. The QFP's are most likely to have tin plated leads and the metallisation on the QFN lands the same, or ENIG. Check the component part datasheets to verify the plating an
