Electronics Forum: thermal (Page 130 of 208)

Time to retire the wave?

Electronics Forum | Fri May 18 13:50:38 EDT 2007 | realchunks

Hi Grant, Replacing a wave witha spot solder? You must have very few comonents to solder or all day to solder them. Why are thinking of doing this? Well, I have looked at just about every selective machine out there. What it all boils down to is

PCB Baking after Wash

Electronics Forum | Thu Dec 04 09:49:11 EST 2008 | lazzara55

Dear Steven: Often the recommendations for baking prior to assembly are derived from various J-stds. But J's currently concern baking moisture out of components, and fail to address the moisture issues of the PCB. Because of that, there is the IPC D

Dymax vs Humiseal Urethane Confomals.... Anyone?

Electronics Forum | Thu Feb 12 15:32:15 EST 2009 | gtemkin

A few other data points to consider. My experience working with Dymax 984LVF material was that its UV cure must be initiated immediately after coating, otherwise is surface will remain tacky forever, something like a post-it note tackiness, which wi

Recommendations on Solder Scavenging Systems

Electronics Forum | Fri May 01 08:15:36 EDT 2009 | davef

Scavenging Methods [Improve Solder Scavenging of Large Area-array Sites, SMT, Laurence Harvilchuck, process research engineer, Unovis Solutions, harvilch@unovis-solutions.com] Two common methods exist for scavenging residual solder on the site for s

Heat insulating box...

Electronics Forum | Mon Jun 07 15:33:08 EDT 2010 | bderks

Hi, I'm working at a very small electronics assembly firm and we need to get a better thermal profile of our reflow and solder wave ovens. Our firm is part of a larger firm that was set up to help handicapped people find work in the Netherlands. Yo

Vapor Phase vs Convection for production

Electronics Forum | Fri Jan 28 19:24:15 EST 2011 | jlawson

Should contact Rehm Thermal they have a whitepaper on pros and cons of Vapor Phase vs Convection.... Vapor phase traditionally targeted heavy PCB, large mass products better then lighter ones, due to ramp rate control being harder to attain vs say a

Reflow oven reliability?

Electronics Forum | Mon Sep 10 08:40:21 EDT 2012 | donkudner

After selecting a few ovens based on the mfr's specifications, I plan to send them a thermal "slug" to run in their ovens (a 1/4" thick, high temp fiberglass slab with imbedded thermocouples). Since we are replacing ovens with fixed speed blowers wit

Temperature variation Heller 1707 EXL

Electronics Forum | Wed Aug 14 18:19:09 EDT 2013 | jlawson

Generally the heller exl range has issues in cross profile, some machines more than others. I have see as bad as 15 deg c and as low as 5 deg c ranging from entire length to a few zones. They never match the specification in reality. The markiii is

Problem with solder joints in wave solder

Electronics Forum | Tue Jan 21 13:51:19 EST 2014 | rgduval

Armando, Is the problem in the same spot on the board with every run? If so, there might be something about that particular location that is part of the cause (ie. ground or power plane connection). It sounds like you're seeing blow holes, or insu

DPAK's sliding off pad during reflow

Electronics Forum | Thu Aug 13 14:10:01 EDT 2015 | markhoch

Hi Sam, I have a feeling that what you're trying to communicate is that your DPAK's are skewing off the pad during reflow. This is caused by a thermal "mismatch" where the solder paste on one side of the DPAK becomes molten before the other, then th


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