Dimension: 420 x 335 x 226mm Weight: 25kg Display Mode: Touch Screen Power: AC90-250V/50/60HZ, 120-220W Cutting Length: 1mm - 99m Stripping Length: 0 - 30mm Wire Size: 0.1 – 2.0mm2 Cutting Tolerance: ≤0.002L mm Middle
Dimension: 420 x 335 x 226mm Weight: 25kg Display Mode: Touch Screen Power: AC90-250V/50/60HZ, 120-220W Cutting Length: 1mm - 99m Stripping Length: 0 - 30mm Wire Size: 0.1 – 2.0mm2 Cutting Tolerance: ≤0.002L mm Middle
Aluminium PCB Materials: Aluminium.This material is made in China and has big competitive price. Layer Number: 1 Board thickness: 1.0mm Surface technique: Pb free HAL Minimum hole size: 0.30mm Minimum Line/Space: 0.25mm/0.25mm Solder mask: Blac
Definition: Mild Steel (MS) pipes are manufactured using low carbon (less than 0.25%) steel. Due to low carbon content the pipes do not harden and are easy to use. As MS Pipes are made from mild steel they can easily be welded and formed in various
New Equipment | Cleaning Equipment
15 L Digital Ultrasonic Cleaner for Pcb Features: Removes solder paste and flux residue Will not damage delicate assemblies Cleans components with blind holes or complex geometries Uses aqueous or semi-aqueous cleaners Increases reliability
New Equipment | Wave Soldering
WELDING: Manual jet wave soldering pot is most suitable for the small batch PCBA DIP welding, especially for welding the parts of a PCBA ( SMD+DIP chips mixed). REPAIR: Manual jet wave soldering pot is most suitable for repair the PCBA,it can t
NEW REFLOW OVEN TECHNOLOGY FOR SUBSTRATE FLATNESS Easy process transfer Low maintenance, no vacuum pump Superior thermal uniformity Built on the industry-leading Pyramax platform, TrueFlat is a unique reflow oven configuration to s
ASSCON vapor phase reflow soldering systems set standards in soldering technology. The VP 7000 vacuum systems are based on advanced patented high-tech soldering methods, and offer outstanding soldering quality in large series productio
New Equipment | Assembly Services
Copper Wire Mesh Cloth (EMF RF shielding) Application: -Shielding screen in the cable circuits, laboratories, computer rooms. -RFI and EMI shielding net in the electronic devices, power sector, aerospace, information industry, military installa
New Equipment | Fabrication Services
Specifications: Size (L x W): 50 x 50 to 700 x 460mm Minimum component: 0201 Minimum QFP pitch: 0.4mm Minimum IC pitch: 0.30mm Minimum BGA ball diameter: 0.40mm Ball pitch: 1.0mm Maximum BGA size: 74x74mm Service include: PCB layout and BOM design or
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