Electronics Forum | Fri Aug 20 09:02:09 EDT 1999 | Frank
Hello, does anyone knowwhere I can get an underfill stoage cabinet with first-in-first-out system
Electronics Forum | Wed Feb 22 10:02:08 EST 2006 | Aaj
Hi! Why positive displacement technique cannot be used for underfill dispensing? Which is the best technique to dispense underfill?
Electronics Forum | Mon Jun 05 14:04:36 EDT 2006 | Brian
Check with the adhesive manufacturer. Not all underfill material is reworkable. Brian
Electronics Forum | Mon Jan 21 11:37:35 EST 2008 | rayjr1491
Is there a tool to check for voiding in a Underfill process?
Electronics Forum | Thu May 01 07:36:14 EDT 2008 | realchunks
Does the customer understand why underfill is used? I don't think you will gain anything on this QFN.
Electronics Forum | Fri May 02 13:30:03 EDT 2008 | ck_the_flip
Betcha this is coming from someone who "read" a magazine article on how underfill is so great.
Electronics Forum | Fri Sep 25 08:34:39 EDT 2020 | SMTA-64386317
Supplier would like to know the appropriate ball height to ensure suit to SMT and underfill process. Undefill using epoxy.
Electronics Forum | Fri Sep 25 10:02:12 EDT 2020 | SMTA-64386317
Yes, underfill process with dispensing. Customer require component must withstand certain strength.
Electronics Forum | Thu Aug 23 13:29:07 EDT 2001 | morefun
Some of our other divisions have had to do epoxy underfill with BGA devices to obtain adequate reliability for aerospace applications. Are there any special layout considerations required to ensure that we can do underfill if we deem it necessary du
Electronics Forum | Thu Aug 23 20:31:53 EDT 2001 | davef
We never underfill BGA, but then again our products are not blasted into space. Certainly you need to provide enough room for the dispense head to move around the component in the pattern appropriate for the underfill you plan to use. Probably more