Electronics Forum: 0.8 (Page 2 of 14)

Repairing balls on BGA's

Electronics Forum | Thu Jul 10 02:49:34 EDT 2003 | emeto

Hi! One technique: 1. Remove all balls 2.Make a mask(stensil)for reballing.The holes of the mask must be 0.8-0.9 the size of the pads. 3. Reball chips 4. Reflow chips Good luck

Solder Volume for Lower Profile PBGA

Electronics Forum | Thu Sep 29 20:26:58 EDT 2005 | DasonC

Any aperture/stencil thickness suggestion to provide a rigid solder joint for 0.8mm pitch PBGA with 0.4mm ball diameter. The pad is based on IPC7095 and it is 0.3mm. Thank!

SMD coil land pattern recommendation size

Electronics Forum | Mon Sep 18 01:47:18 EDT 2017 | bukas

I would go with wire thickness + 0.4 to 0.8 mm for pad width, and pre-tinned lenght + 0.5mm what seems to me like problem is that it can easily roll off the pads in reflow oven

APerture size for microBGA

Electronics Forum | Thu Jun 29 09:12:27 EDT 2000 | sree

What is the best aperture opening for micrBGA with 0.8 mm ball pitch and 16 mils ball diameter?The pad size on the PCB is 12 mils.

PCB thickness

Electronics Forum | Wed May 17 11:00:00 EDT 2000 | emmanuel

Has somebody yet process pcb (FR4) with a thickness of 0.8 mm ? Thank you for all kind of responses.

MELF component short togehter

Electronics Forum | Wed Jun 12 22:35:03 EDT 2002 | jkhiew

We had alot of problem with melf diode short together after reflow soldering. The clearance is about 0.8mm & we used "v" shaped opening . PLease comment !

TOMBSTONE DEFECTS

Electronics Forum | Thu Mar 27 12:25:14 EST 2003 | kenlchin

additonally, minimizing the rising rate aroud 183'c and decrease the droping rate(near 0.8'c/s) is also a good way .

CSP No clean residue

Electronics Forum | Wed Dec 08 08:38:46 EST 2004 | davef

KS: You're correct. The standoff on a 1.00mm and 1.25mm BGA is high enough to allow cleaning. The standoff on 0.8mm BGA does not allow proper cleaning, even with saponifiers.

Component Package/Classification

Electronics Forum | Wed Apr 13 08:00:57 EDT 2005 | davef

Dimension mm (LXW)||JIA||EIA 1.0X0.5||1005||0402 1.6X0.8||1608||0603

skew components

Electronics Forum | Mon Sep 26 07:56:38 EDT 2005 | pavel_murtishev

Hi! Try to make "R_AXIS_ACCURACY" calibration for all of FNC heads for back camera only. I met such problem on Topaz-X. There was clearly seen offset on 0.8mm pitch components. I simply calibrated all cameras for FNC nozzles and problem disappeared.


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