Industry News | 2011-09-21 14:12:49.0
JBC Tools will exhibit in Booth #609 at the upcoming SMTA International Conference & Exhibition.
Industry News | 2010-06-23 13:42:53.0
Practical Components, a leading international supplier of solder training kits and materials, mechanical IC samples or “dummy” components and SMD production tools and equipment, announces the capability to design custom practice PC boards or complete kits.
Industry News | 2021-08-26 11:02:27.0
SHENMAO America, Inc.'s Joint Enhanced Solder Paste (JEP) PF606-EP305 offers the advantages of both conventional solder paste and anisotropic conductive paste, i.e., self-alignment and planar insulation, respectively. JEP enables soldering and joint encapsulation in one step reflow.
Industry News | 2018-10-18 08:32:52.0
How to Prevent Solder Ball and Bridging Defects during the SMT Reflow Process
Industry News | 2003-07-08 09:09:15.0
Available for Devices Up to 13 mm2 with Speeds Up to 1 GHz
Industry News | 2003-06-13 10:10:58.0
By combining PacTech's electroless under bump metallization (UBM) processing with DEK's advanced mass imaging systems to create the solder bumps, users can implement a wafer-level, SMT-compatible flip chip assembly process.
Industry News | 2003-02-14 08:03:50.0
Provides Devices with Excellent Protection Against EMI and Overcomes Limitations of Metal Cans
Industry News | 2018-10-09 18:31:30.0
Whether in production, or repair and rework, the cost of soldering iron tips can be easily overlooked, but with today’s requirement for higher temperatures in lead-free solder applications, the consumption of tips has dramatically increased. This fact, combined with changes in tip design to meet the higher thermal load requirements, has also resulted in escalating tip costs, making tip care a high priority.
Industry News | 2021-03-02 14:45:26.0
SHENMAO America, Inc. is pleased to introduce its newJoint Enhanced Solder Paste (JEP) PF606-EP305 and Solder Joint Encapsulation Material (SJEM) Flux SMEF-Z52. The new epoxy-based solder materials for very fine pad size (70 μm) soldering, especially for advanced display packaging and assembly.
Industry News | 2016-04-20 18:39:31.0
Saki Corporation will present its 2D and new 3rd generation 3D automated optical inspection (AOI) systems at NEPCON China 2016, held from April 26-28, at the Shanghai World Expo & Exhibition Center, in stand 1J25. Technical experts will be at the booth to discuss the factors to consider to determine the correct AOI system for specific inspection and measurement needs.
