Electronics Forum: 0805 and pad and design (Page 2 of 9)

Re: Standard pad sizes for reflow and wave

Electronics Forum | Sun Sep 05 03:52:11 EDT 1999 | Brian

| We've noticed that there are many different recommendations for pad sizes for various SMT parts. This seems to vary wildly from manufacturer to manufacturer for the same case sizes. Is there any standards that can used used to specify these sizes

Re: Standard pad sizes for reflow and wave

Electronics Forum | Tue Sep 07 09:11:33 EDT 1999 | Dave F

| We've noticed that there are many different recommendations for pad sizes for various SMT parts. This seems to vary wildly from manufacturer to manufacturer for the same case sizes. Is there any standards that can used used to specify these sizes

0402's and Gluing.............

Electronics Forum | Wed Feb 09 12:28:58 EST 2005 | Valerie

We have been pretty successful with screen printing glue, however the smallest component we now glue is a 0805. We had many problems using our Gemini II to put down glue dots for a 0603, so we altered the pads to do double-side reflow. As our own int

Pad and Stencil Design

Electronics Forum | Mon Sep 17 09:35:08 EDT 2001 | floydl

Based on your research, what is the pad and stencil design that you recommend for 0201 assembly?

0201 and uBGA

Electronics Forum | Wed Jun 05 17:13:58 EDT 2002 | Yannick

Hello! I have a strage problem, we made some production with uBGA, BGA, 0201, 0805, and other type of component. We didn't put the uBGA and 0201 and BGA on the board at the end of the line we look a our solder joint and surprise the solder made a

Pad and Stencil Design

Electronics Forum | Mon Sep 17 16:03:13 EDT 2001 | jschake

The results from an experiment comparing 27 different combinations of pad dimensions concluded that the pad design with 15 mil pad length, 12 mil pad width, and 9 mil pad separation produced the best assembly yields. A 5 mil thick laser cut stencil

Pad and Component Dimensions

Electronics Forum | Mon Jun 02 11:36:23 EDT 2003 | swagner

A good place to get the data you are interested in would be Philips CFT design guidlines.

Pad and Component Dimensions

Electronics Forum | Tue Jun 03 08:15:10 EDT 2003 | davef

On pad design, look here: http://www.smtnet.com/forums/Index.cfm?CFApp=1&Message_ID=18036 On component sizes, look here: http://www.practicalcomponents.com

Pad and Stencil Design

Electronics Forum | Sat Feb 09 17:33:30 EST 2002 | George Verboven

For more info about Metal Stencil Overview. also look at: http://www.tkb-4u.com/articles/printing/metalstenciloverview/metalstenciloverview.php

Pad and Stencil Design

Electronics Forum | Mon Sep 17 17:49:02 EDT 2001 | arzu

What about the material of the stencil? Nickel formed? stainless steel? even more materials are available, some with different ways to form the apetertures.


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