Industry News | 2009-07-28 12:23:26.0
In a breakthrough for emerging package-on-package (POP) device processes, Henkel has developed Multicore® TFN700B™, a new no-clean, halide-free tacky flux material formulated specifically for today’s challenging POP applications.
Industry News | 2009-07-30 21:06:08.0
In a breakthrough for emerging package-on-package (POP) device processes, Henkel has developed Multicore® TFN700B™, a new no-clean, halide-free tacky flux material formulated specifically for today’s challenging POP applications.
Industry News | 2009-09-09 20:07:33.0
Henkel Corporation today announced that the United States Patent and Trademark Office (USPTO) has allowed a patent covering its Ablestik® Self-Filleting® die attach products and controlled flow technique, which have been designed and perfected by the company over the past five years.
Industry News | 2009-09-26 16:30:32.0
Today, the Shareholders’ Committee of Henkel AG & Co. KGaA elected Simone Bagel-Trah as its new Chairwoman. Bagel-Trah takes over this office from Albrecht Woeste who has been a member of the committee since 1976 and became its Chairman in 1990. This coming Tuesday, Simone Bagel-Trah is also due to be elected Chair of Henkel’s Supervisory Board. This completes the transition from the fourth generation of the Henkel family to the fifth. The change at the top of these two supervisory bodies had already been announced at the Henkel Annual General Meeting of spring 2008.
Industry News | 2009-11-09 12:17:18.0
Henkel Corporation’s electronics group has signed on two new representatives to support its sales initiatives in Northern California and the Texas/Oklahoma region. The firms, Moore Integrated Technologies and The NiMar Group, respectively, are both managed by industry professionals with a long and successful history in the electronics marketplace, thus upholding Henkel’s pledge to enable its customers’ success through expert, local and accessible sales support.
Industry News | 2009-11-24 22:07:52.0
Henkel’s in-depth materials development initiatives surrounding halogen-free innovation has yielded another process-enabling product. Multicore HF108 is a lead-free, halogen-free solder paste that combines all of the benefits of robust lead-free materials with the advantage of no deliberately added halogen and is now commercially available.
Industry News | 2009-12-10 01:05:59.0
Building on its successful lead-free solder products portfolio, Henkel has developed Multicore LF730, a Pb-free solder paste born from the company’s unyielding innovation commitment and arguably setting the benchmark for lead-free paste performance.
Industry News | 2009-12-18 17:46:04.0
onoring its commitment to deliver easy access to world-class materials solutions, Henkel Corporation’s electronics group today announced an extension of its representative network in the United States.
Industry News | 2009-07-24 13:38:04.0
To address the thermal requirements posed by smaller outline, higher functioning power semiconductor devices, Henkel has formulated an advanced die attach solder paste suitable for both high-lead and lead-free applications.
Industry News | 2009-11-19 14:48:22.0
Broadening its well-known Multicore die attach solder portfolio, which already includes Multicore DA100 solder paste for high-lead and lead-free applications, Henkel today announced the launch of Multicore DA101. This newest formulation delivers many of the well-known benefits of Multicore DA100, but has been designed for screen print operations, thus offering flexibility for varying process requirements.
