Industry News: 142 (Page 2 of 3)

SHENMAO Offers Quality Low-Temperature Solder Paste for SMT Devices

Industry News | 2019-05-20 18:51:08.0

SHENMAO America, Inc. introduces PF735-PQ10 Low Temperature Solder Paste. Qualified by a third-party organization, the PQ10 series of low temperature solder paste is made with a modified Sn/Bi alloy that has a lower melting point range from 137°~142°C to 137°~170°C. This makes it ideal for SMT devices, which can have sensitive components that cannot withstand higher temperatures.

Shenmao Technology Inc.

TRI to Feature Innovative Inspection Solutions at NEPCON Japan 2020

Industry News | 2019-11-27 12:21:14.0

Test Research, Inc. (TRI) will join NEPCON Japan held at Tokyo Big Sight to showcase state-of-the-art Inspection Solution for Smart Factories. Visit booth #W1-42 to experience Smart Factory Inspection Solutions in action.

TRI - Test Research, Inc. USA

Japanese technology giants fall ? Toshiba sells the core chip business

Industry News | 2018-08-21 03:18:10.0

According to public statistics, since 2010, the 142-year-old Japanese technology giant has started to move from profit to loss. Due to the impact of nuclear power and other businesses, Toshiba has a huge debt of US$6.1 billion (about 41 billion yuan). It was forced to start the road of selling debts.

Jotrin Electronics Limited

New Inline Printer For Fine Pitch

Industry News | 2005-09-23 13:31:20.0

The SP200-AVC from ESSEMTEC is a new stencil printer for fully automatic SMT assembly lines. The unique trans-stencil vision system, the integrated stencil cleaner and the continuous squeegee pressure regulation provide highest precision and reliability. The printer is designed for quick setup and changeover.

ESSEMTEC AG

SiC MOSFET-based Power Modules Utilizing Split Output Topology for Superior Dynamic Behavior

Industry News | 2013-11-28 07:37:50.0

The split output topology negates the limitations of the SiC MOSFET.

Vincotech

SHENMAO to Exhibit Low-Temperature Solder Pastes at ECTC

Industry News | 2019-04-15 06:42:26.0

SHENMAO America, Inc. is pleased to announce that it will exhibit at the 2019 IEEE Electronic Components and Technology Conference (ECTC), scheduled to take place May 28-31, 2019 at The Cosmopolitan of Las Vegas. The company will showcase its PQ10 series low temperature solder paste in Booth #500.

Shenmao Technology Inc.

Fox's Newest Cost Effective High Stability Oscillators

Industry News | 2004-09-28 22:58:43.0

Fox Electronics has expanded its line of oven controlled crystal oscillators (OCXO) with the addition of its newest precision oscillators utilizing SC-cut resonators. The new FTE oscillators, which offer exceptionally high frequency stability, are available with HCMOS output for telecom and switching applications (AH series) or with sine wave output for wireless, satellite communications, and navigation applications (AS series).

FOX Electronics

SHENMAO to Debut New Solder Wire for Automatic Soldering Equipment at APEX

Industry News | 2019-01-05 16:26:04.0

SHENMAO America is pleased to announce that it will exhibit in Booth #1304 at the 2019 IPC APEX EXPO, scheduled to take place Jan. 29-31, 2019 at the San Diego Convention Center. The company will showcase its new PF606-F13 solder wire and PQ10 series low temperature solder paste.

Shenmao Technology Inc.

New Yorker Electronics Announces Sumida's Upgrade to Popular Power Inductor Series

Industry News | 2022-05-28 13:29:12.0

New Power Inductor has Increased Inductances, Saturation Current and DCR Values vs. Previous Model

New Yorker Electronics

Samsung Electronics Aims To Be No.2 Chipmaker

Industry News | 2001-10-29 09:13:06.0

South Korea's Samsung Electronics Co Ltd, the world's fourth largest chipmaker, aims to rank second by the end of 2005 and raise its share of the global memory chip market to 30 percent. Samsung, already the largest memory chip maker, is selling 40 percent of its chips for below production cost, reflecting a record downturn in the global chip market.

Hanwha Techwin CO., LTD.


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