Electronics Forum: 2

are Philips CSM Orion/85vz feeders compatible on CSM 46/60?

Electronics Forum | Tue May 01 13:52:51 EDT 2007 | jasont

plz advise if the below feeders are compatible on CSM 46/60 (are they downwards compatible?); 1. Philips series FV-84-xxxxxC, model PA2903/70 (2,4 pitch, 8mm) QTY=29 2. Philips series FV-82-7-xxxxD, model PA2903/73 0603-type (2,4 pitch, 8mm

force between the pad and laminate material

Electronics Forum | Wed Jun 12 08:13:29 EDT 2002 | davef

Don't sound proper. There is no specification. Pad peel strength test methods are: * IPC-TM-650, Method 2.4.21 for multiple solderings * IPC-TM-650, Method 2.4.8 for copper peel with a Instron machine. Typical requirement for Cu is: 6 lbf/in [1

I am looking for an IPC spec for intentional PCB warp

Electronics Forum | Mon Dec 22 16:20:03 EST 2014 | warwolf

Basically the contract comes first, then the design drawings then IPC. if your costumer is asking you to bend the PCB then it becomes apart of the design drawings. as for looking for a cover, get it in writing that that's what they want you to do. I

Is anyone doing repairs on Universal GSM cameras?

Electronics Forum | Mon Jun 28 16:18:01 EDT 2004 | Steve

Universal does not do this anymore. I have 3 cameras which need repair, but would alternatively be willing to sell cores. 2, 4 mil and 1, 2.6 mil

Re: RTV Cure Questions

Electronics Forum | Fri Jun 23 14:23:20 EDT 2000 | Brian W.

We used to cure RTV3145 in an oven at 180 F for 2-4 hours Hope this helps, Brian

PCB Thickness tolerances

Electronics Forum | Tue Jan 30 10:19:20 EST 2001 | ibi

I think that tolerance of pcb thickness is described in the �1-2-4 of IPC41-01 (Specification for Base Materials for Rigid and Multilayer Printed Boards Supercedes IPC-L-108, L-109, L-112, L-115, AM-361). Good reading,

component aherence force on the solder paste before reflow

Electronics Forum | Mon Jul 02 09:28:24 EDT 2001 | blnorman

You can test for solder paste tack using IPC-TM-650 method 2.4.44. This will give you an idea of the adhesive strength of your paste prior to reflow.

Reg: Measurement Systems

Electronics Forum | Mon Sep 28 12:43:48 EDT 1998 | Manish Ranjan

Hi Everybody My company is looking to buy some precision measurement systems to measure the height of flip chip bumps (nominal height of 100 microns). We are looking for a resolution of about 2 - 4 microns. Any help would be appreciated. Thanks Man

MY12 tpsys shutdown

Electronics Forum | Tue Nov 08 14:20:39 EST 2005 | OverTheHill

"We have four new MY12's running version 2.4.3i software." New? Call MyData, dumb-ass.

Black Pad

Electronics Forum | Tue Jan 10 12:53:16 EST 2006 | muse95

There is a tape test from IPC in their TM-650 spec that can be downloaded for free from the ipc website. It will test for gold adhesion to the underlying nickel. Section 2.4.1E, I believe. It is quite simple to perform.


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