Electronics Forum | Tue Jul 18 09:05:54 EDT 2017 | davef
Acceptability of Electronic Assemblies IPC-A-610 F Comparison E to F versions * http://www.electronicsyorkshire.org.uk/UserFiles/PDFs/610E%20to%20F%20Redline%20comparison.pdf * https://www.youtube.com/watch?v=kD5NpsocTpw * http://www.scanditron.c
Electronics Forum | Mon Jun 07 17:58:12 EDT 2004 | Rob
UPDATE: Just for fun... I sacrificed a scrapped board to determine what remained and what fell and this is the result. Board dimension was 18"x9" and .9" thick. Components consist of hundreds of passives plus 386 proc (QFP256), TSOPs, SOLs 14/16/20,
Electronics Forum | Fri Sep 22 13:15:19 EDT 2006 | jaimebc
We are currently experiencing some MCSB's on 0603 components. I am looking into experimenting with the stencil thickness from 6 mil to 5 mil and also using Radiused inverted homeplate ( 20%60%20)to eliminate or reduced this problem. We are using lea
