Electronics Forum: 2nd and reflow (Page 2 of 60)

Tg and reflow

Electronics Forum | Mon Dec 19 07:49:33 EST 2005 | davef

=330*C is good advice. Search the fine SMTnet Archives for earlier discussions on Td, like http://www.smtnet.com/forums/Index.cfm?CFApp=1&Message_ID=32430

Tg and reflow

Electronics Forum | Mon Dec 19 12:21:09 EST 2005 | Amol Kane

from what i know, Tg is important from thermal stresses point of view. board warpage increases greately when Tg is exceed

DPAK drop @Second reflow

Electronics Forum | Tue May 31 22:40:24 EDT 2011 | bejrananda

HI All, Please kindly advice me, I have project that it has DPAK part (MPN:SUD25N15-52 E3 Plating:100% Sn matte)which locate on bottom side (1st reflow), Good wetting for 1st reflow.. but .. when I run Top side (2nd reflow).I found that this D

What caused this reflow issue?

Electronics Forum | Mon Apr 14 16:21:58 EDT 2008 | ck_the_flip

Bottom-side SMT parts CAN and DO go liquidus during the 2nd reflow cycle. It could be that there was enough variability between the 2 different lot code PCBs to cause the parts to fall off. Remember wetting force determines surface tension (the abi

lead free for multiple reflow process

Electronics Forum | Tue Sep 11 22:40:26 EDT 2007 | philip_yam

We are testing SAC paste for thru-hole components in the 2nd reflow process. The solder joint is alright but some problem encountered in FR1 or CAM2 PCB after multiple times of reflow due to the temperature. We are very interested in Zn or Bi-based l

help with LEDs and reflow

Electronics Forum | Tue Aug 10 11:23:11 EDT 1999 | danielm

We currently have 32 LEDs per board and are looking to change the LED from a gull wing package to another package. (possibly a chip type package). I have heard that some cases and LEDs do not like reflow. This part is not cost effective to have to pu

01005 components and reflow profiles

Electronics Forum | Mon Apr 16 10:01:03 EDT 2012 | patrickbruneel

*Like*

01005 components and reflow profiles

Electronics Forum | Tue Apr 10 04:16:20 EDT 2012 | grahamcooper22

you are seeing a typical issue that is caused when such small volumes of paste are printed....there are several reasons for it..the tiny amount of flux in the small deposit becomes exhausted much quicker then it does in a larger deposit ( the flux ma

01005 components and reflow profiles

Electronics Forum | Mon Apr 16 20:04:24 EDT 2012 | hegemon

6 or 7 replies and 3 *flamer* ratings already? And here I thought this was good info above...

01005 components and reflow profiles

Electronics Forum | Mon Apr 09 20:55:46 EDT 2012 | action_101

I forgot to add that we are using a 3 mil stencil. It seems like to me that may be there isn't enough flux left when we reach liquidous?? About half of the solder spheres do melt and wet on each pad, but the top half of each solder joint is just the


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