Electronics Forum: 315 (Page 2 of 5)

Cleaning Indium TACFLUX007

Electronics Forum | Fri Jun 14 14:19:17 EDT 2002 | davef

Consider: * 007 is a no-clean flux. Some no-cleans you can clean, some you can�t. You may be able to use a saponifier & surficant to clean the residue. Check with your flux supplier for recommendations. * 320�C is higher than the 315�C peak for th

RoHS Compliant PCB Repair Kit

Electronics Forum | Thu Oct 05 13:00:54 EDT 2006 | Mario Scalzo, SMT CPE

Good afternoon! We have a Hand Assembly & Rework Pb-Free RoHS compliant kit available! Please email me offline. Should you have any further questions, please don't hesitate to ask. My contact information is below. Regards, Mario Scalzo, SMT CPE

ZCR/QUAD Reflow oven problem.

Electronics Forum | Wed Aug 08 08:39:56 EDT 2012 | graememurphy

I am charged with maintaining two ZCR/QUAD reflow ovens and one has a problem I have not come across before.... Upon startup it displays the message "CRITICAL TEMPERATURE" but the eight zones are at ambient, the set temperatures being 315°C to 400°C.

ansi - esd s20.20 certification in Canada

Electronics Forum | Fri Jun 19 19:52:34 EDT 2020 | davef

Has the snow melted up there yet? I'm aware of ppl that might give you a lead ... + Advanced ESD Services near Binghamton, NY 607-759-8133 dbellmoreATechoes.net + EOS/ESD Association, Inc. 7900 Turin Rd, Building 3, Rome, New York 13440, USA | 315

Re: Bakeing

Electronics Forum | Mon Nov 27 17:39:37 EST 2000 | Dave F

Daniel: In response to your questions: * Moisture level (wt%) that may cause delamination in PCB�s. - Certainly, it depends, but 100% moisture will not cause delamination of a PCB. [Now, heating that water is another question, isn�t it? ;-)] *

Solder-ability problems with SN100C Lead Free HASL

Electronics Forum | Thu Oct 05 11:59:51 EDT 2006 | Mario Scalzo, SMT CPE

Good afternoon all! Theoretically, there should not be any issues soldering to the SN100C as the tin content of the molten paste alloy should wet to the finish with no problem. I would just ensure that the peak temperature of the joint is above the

Indium Solder Hermetic Seal Voiding

Electronics Forum | Wed Jan 10 17:08:12 EST 2007 | mscalzo3

Brian, There are a couple of ideas that you can use for this. Slowing the ramp is the first one that comes to mind. I would try soaking at about 10 degrees "C" below the solidus of the alloy for about 45-60 seconds. Slowing the ramp to remove the

Solder On Gold Mounting Holes, Gold Pressure Fit Socket Lands

Electronics Forum | Tue May 06 15:33:36 EDT 2008 | operator

I know IPC-A-610 RevD has requirements for Gold Fingers and solder contamination. Is there any such requirements for Gold Mounting Holes, Gold Pressure Fit Socket Lands (SMT pads), Exposed Gold Traces ? Wouldn't these all be considered "critical cont

interchangeable stencil frame systems

Electronics Forum | Thu May 03 10:23:33 EDT 2001 | davef

Yes, Alpha's frames help develop upper body strength. All stencils, regardless of the type of frame, can have loose foils. Stencils with removable foils require a specialized storage system for the foils and lots of band-aids. Some foil frame su

Re: E-Fab Stencils

Electronics Forum | Mon Dec 28 20:34:38 EST 1998 | Chris Grendler

| | Any one know a good stencil vendor who can produce stencils below .002" foil with appetures at .004" on .008" pitch? AMTX use to be my vendor but they are closed down. | | | | Thanks, | | | | Chris Grendler | | | Chris: One source of e-for


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