Electronics Forum | Sat Apr 23 00:21:10 EDT 2011 | azrina
As am doing screening right now, am not measuring the total cleanliness yet, i just observe by taking photos (FYI, am varying speed for conveyor belt for cleaning) and see whether the flux is able to be removed by certain parameters. the speed am usi
Electronics Forum | Mon Mar 02 11:13:59 EST 2009 | jorge_quijano
Hi to everyone, I'm new with the Solder Paste Inspection machines, and I'm doing my first measures and I noticed that I'm getting a solder paste heigth of 7 & 8 mils using a 5.0 mils stencil, with metal squeegees and 0.0 Snap off. are this results no
Electronics Forum | Fri Oct 03 09:00:18 EDT 2003 | davef
EIA standard packages have a variety of L/W proportions. EIA||Dimension mm (LXW)||Proportion (L/W) 0201||0.6X0.3||2 0202||0.5X0.5||1 0303||0.8X0.8||1 0402||1.0X0.5||2 0504||1.25X1.0||1.25 ||1.4X1.4||1 0603||1.6X0.8||2 0805||2.0X1.25||1.6 1111||2.8X2
Electronics Forum | Wed Nov 06 06:34:26 EST 2019 | kylehunter
We have a DEK HORIZON 265 that seems to be having an issue with the pressure setting for the squeeges. It seems to have an override making the set point of the squeege pressure always be 5kg. I have it set to 12kg, but on the first print, it errors
Electronics Forum | Tue Nov 02 09:29:21 EST 1999 | Wolfgang Busko
Hi Kevin, you could use a fixture for supporting the assembly. I think it�s a common solution for thin PCBs. For the design you could search the archive there are some tips on this already ( search for support, fixture, pallet ). hope this helps Wo
Electronics Forum | Wed Feb 04 06:26:20 EST 2009 | sachu_70
Hi Peter, The defect you observe during the second side reflow could be caused due to improper Au plating thickness in the PCB fabrication process. You can refer IPC-2221 wherein plating thicknes for ENIG mentions 0.08um to 0.23um for Immersion Gold,
Electronics Forum | Thu Mar 05 09:54:59 EST 2009 | davef
When you measure "solder paste heigth of 7 & 8 mils using a 5.0 mils stencil," are you measuring the top of a flat brick? Sometimes if you snap-off the stencil too fast, the paste touching the stencil walls form peaks along the edge of the brick that
Electronics Forum | Fri Apr 06 19:06:38 EDT 2007 | davef
There is no standard for what you're trying to accomplish. We recall a similar thread on SMTnet. In it, a poster suggested: "Call them: 1206T.5, 1206T1.0, SOIC16, RESNET16, SOIC16T5.0, ALCAP4, ALCAP5 etc., where: T means thickness but for the ALCAP
Electronics Forum | Tue Nov 02 08:57:36 EST 1999 | Kevin DuCasse
This is our first time out processing material with a finished thickness less than the standard 0.062 FR-4 material. We have an assembly that uses GIL MC5 with a finished thickness of 0.035 and we are having difficulty at placment with the array "bo
Electronics Forum | Thu Mar 23 00:37:47 EST 2000 | Donnie DeYoung
Thanks guys. We are currently using an Opti Flux fixed spray head at 10 to 20 psi. We were using the 351 flux at 60 psi before this, so as you can see we found that there's a huge difference here. We are currently running a conveyor speed at 5.0 FPM.
