Electronics Forum | Mon Jan 04 23:15:35 EST 1999 | Kris Ewen
Where I worked, we used 0.014" square aperatures (several mfgs. have proven the benefits of square & I've seen a better transfer efficiency myself). Some mfgs use smaller edge lengths & have had success. 0.005" thick stencils give better transfer e
Electronics Forum | Wed Sep 11 07:37:11 EDT 2002 | mk
Whoaaaa Genny, Its not that bad!!! The difficulty factor is in assembling your own boards is all releative to how many, and how difficult they are. Most studies show that the vast majority of defects in smd assembly are generated in the application
Electronics Forum | Tue Oct 01 16:19:35 EDT 2002 | dragonslayr
Hello all- I am am seeking information to the top 100 BGA grid patterns. I am planning to have a full sheet of stencil foil populated with these most common types. I will cut out the individual grid patterns and create my own mini stencils. In a 27
Electronics Forum | Fri Sep 15 15:50:54 EDT 2006 | Steve
Good info, Russ. I'm glad we aren't the only ones that go to extra lengths to use up short strips of parts, both kitted and our own supplied parts. The tought part is making the call to throw out the left-overs since the operators generally don't kno
Electronics Forum | Mon Nov 09 09:18:09 EST 2009 | meritajs
I absolute agree with Adlsmt that your subcontractor was slipshod worker. It’s impossible for normal subcontractor make such fault. For last 15 years I worked for subcontractor firm here in Riga Latvia. Our company was not very advanced. As I said be
Electronics Forum | Mon Jul 18 21:36:18 EDT 2022 | ttheis
We have two GSM machines (4-spindle, single beam) and had a camera fail on one machine. We decided to clean and calibrate the cameras on both machines. One machine we had no problems and all is working properly. The other machine will not pick up the
Electronics Forum | Sat Jun 12 00:34:00 EDT 2004 | kanwal324
Hi ! The main problem being faced currently is formation of solder balls - to be precise, these are micro solder beads generally found attached with bodies of SOTs, Chip Caps, Chip Resistors, between pins of SOICs (50 mil) - lying on PCB surface,
Electronics Forum | Wed Sep 01 08:27:38 EDT 2004 | davef
Zinc from the brass [Cu3Zn2] diffuses into the tin causing solderability problems. Just 0.001% of Zn in your solder can render it fit for the scrap heap. So, you need a barrier plate between the brass and the tin. Copper or nickel-plating is commonl
Electronics Forum | Wed Jul 24 01:53:58 EDT 2002 | Mike Konrad
Using ultrasonic technology to remove adhesive is normally not that difficult. I do not know who�s machine you are using (perhaps its ours). In any case, here are some tips for removing adhesives. 1. Heated wash chemistry works better than ambien
Electronics Forum | Sat Feb 14 19:35:51 EST 1998 | C. Lao
Mr Lao We have some specialist knowledge on this subject and offer both equipment and services for these tests. My first recommendation is that take coupons manufactured by your PC Fabricator and then samples at each manufacturing stage: Bare coupon
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