ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/industries/medical-life-science-and-pharmaceutical?con=t&page=5
% nondestructive test evaluation to be performed in a repeatable manner for both the development of new devices and in the production line. Medical devices and medical electronic systems are key areas where reliability is paramount
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/products/x-ray-inspection-systems?con=t&page=3
. X-ray Inspection Criteria & Common Defect Analysis Nordson DAGE The definitive guide to understanding electronics manufacturing defects using X-ray inspection is back for a second edition
Surface Mount Technology Association (SMTA) | https://www.smta.org/smtai/call_for_papers.cfm
Best student presentation = $500 Abstracts are still being accepted! Acceptance Notification: May 2020 | Final Papers Due: July 24, 2020 When a paper is accepted by the Technical Committee, it is our expectation that you have budget approval for travel costs and conference registration which is required for speakers
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/application/x-ray
Contact Global HQ Africa Asia Central and South America Europe USA and Canada Nordson DAGE Home Applications X-ray X-ray Get the Best from Your 3D Model There is a continuing trend for miniaturization
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/journal.cfm
. Journal of SMT Articles The Journal of Surface Mount Technology is a quarterly, peer-reviewed journal featuring jury-selected technical papers
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/asymtek/your-process/fluid-types/underfill
. Offering non-contact jetting systems for underfill dispensing with precision fluid placement. What is Underfill? Underfill is an epoxy material that fills gaps between a chip and its carrier or a finished package and the PCB substrate
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/fatigue?con=t&page=17
. Failure by fatigue is a major factor in reliability and fatigue testing provides valuable data to compare materials for resistance and assess a component’s lifetime
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/creep-testing?con=t&page=15
. Our experience with solder has led us to develop methods for applying loads to small samples as the solder joint is the weakest connection in a printed circuit board
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/high-strain-rate?con=t&page=7
. Force has a tendency to increase with strain rate, so border line failures may not be identified. 2. The amount of energy that a solder ball can absorb decreases with the presence of voids and the percentage difference in energy between failure modes is considerably more apparent than force
