Technical Library | 2013-01-30 14:02:44.0
Many OEM’s require that individual wires and cables used in their products be clearly identified with a mark or label. For some, such as in the military and aerospace markets, wire and cable identification (or “wire ID”) is mandatory and the process is governed by stringent specifications, such as SAE AS50881 (formerly MIL5088L). For others, the decision to use wire ID is a voluntary one. This article will describe what type of information is typically identified on wire and cables, concepts for improved productivity, what types of systems are available and the pros and cons of each.
Technical Library | 2014-03-20 12:37:39.0
In the beginning of SMT, Vapor Phase Soldering was the preferred reflow soldering technology because of its excellent heat transfer capabilities. There were also some disadvantages like fast temperature rise, nearly no influence on the temperature profiles and high costs. So the use of Vapor Phase Soldering was reduced to special applications with high mass or complex boards in low numbers (e.g. for military or aerospace use).
Technical Library | 2018-09-12 21:04:28.0
Counterfeit electronic components are finding their way into today’s defense electronics. The problem gets even more complex when procuring DMS (diminishing manufacturing source) parts. This paper will provide a brief introduction to counterfeit prevention and detection standards, particularly as they relate to the Aerospace and Defense sector. An analysis of industry information on the types and nature of counterfeit components will be discussed in order to illustrate those most likely to be counterfeited, followed a specific case at a major defense contractor.
Technical Library | 2021-11-29 01:10:58.0
ASHCROFT pressure transmitter is one of the most commonly used transmitters in industrial applications. It is widely used in a variety of control environments, involving water conservancy and hydropower, railway transportation, intelligent building, production automation, aerospace, military, petrochemical, oil wells, electric power, ships, machine tools and pipelines. ASHCROFT pressure transmitter is an electronic device that senses the pressure signal and converts it into an available output electrical signal according to certain rules.
Technical Library | 2022-03-02 21:52:34.0
In today's consumer-driven electronic marketplace many products have a limited useful life and component suppliers are moving to shorter product lifecycles. However, there are several industries that require semiconductor components to have a much longer lifecycle. In many cases application lifecycles within the Industrial, Automotive, Medical, Aerospace and Defense sectors may extend up to 30 years or more. As a result, an ongoing component supply becomes critical to sustaining these applications throughout their useful lifecycle. For this reason, it is often a requirement that semiconductor components be stored for extended periods of time after production ends.
Technical Library | 2013-04-04 15:28:39.0
This paper will outline and define what requirements must be adhered to for the OEM community to truly achieve the IPC class product from the Electrical Test standpoint. This will include the test point optimization matrix, Isolation (shorts) parameters and Continuity (opens) parameters. This paper will also address the IPC Class III/A additional requirements for Aerospace and Military Avionics. The disconnect exists between OEMs understanding the requirements of their specific IPC class design versus the signature that will be presented from their design. This results in many Class III builds failing at Electrical Test... First published in the 2012 IPC APEX EXPO technical conference proceedings
Technical Library | 2014-01-23 16:49:55.0
As reliability requirements increase, especially for defense and aerospace applications, the need to characterize components used in electronic assembly also increases. OEM and EMS companies look to perform characterizations as early as possible in the process to be able to limit quality related issues and improve both assembly yields and ultimate device reliability. In terms of BGA devices, higher stress conditions, RoHS compatible materials and increased package densities tend to cause premature failures in intermetallic layers. Therefore it is necessary to have a quantitative and qualitative test methodology to address these interfaces.
Technical Library | 2014-05-08 16:34:16.0
Bare die mounting on multi-device substrates has been in use in the microelectronics industry since the 1960s. The aerospace industry’s hybrid modules and IBM’s Solid Logic Technology were early implementations that were developed in the 1960’s. The technologies progressed on a steady level until the mid 1990’s when, with the advent of BGA packaging and chip scale packages, the microelectronics industry started a wholesale move to area array packaging. This paper outlines the challenges for both traditional wire-bond die attached to a printed wiring board (pwb), to the more recent applications of bumped die attached to a high performance substrate.
Technical Library | 2014-01-09 16:40:33.0
Embedded Passive Technology is a viable technology that has been reliably used in the defense and aerospace industry for over 20 years. Embedded Passive (Resistors and Capacitors) Technology have a great potential for high frequency and high density applications. It also provides better signal performance, reduced parasitic and cross talk. This paper summarizes the selection of resistor embedded materials, evaluations of resistive material (Phase 1) and duplication of a complex digital design (Phase 2). Phase 1 –resistive materials (Foil 25Ω/sq NiCr and 1kΩ/sq CrSiO) and resistive-Ply materials (25Ω/sq and 250Ω/sq NiP) were chosen for evaluation.
Technical Library | 2016-08-24 06:15:35.0
From consumer electronics to systems control, automotive technology to aviation and aerospace – today, electronics are absolutely essential in many sectors. They increasingly replace mechanical components, eliminating wear and tear and thereby extending the service life. What is easily forgotten in this regard is that electronics are also subject to the laws of mechanics. Mechanical test equipment is crucial to test components for the secure hold of welded, soldered or adhesive bonds. A new, mechanically intricate test probe with universal clamping jaws, that can even grasp the individual bonding wires, is in line with the trend toward ever smaller components. Serving as an actuator for these is a micro drive that can be precisely controlled using a miniaturised motion controller to relieve the control unit in the test device.
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