New Equipment | Solder Paste Stencils
ALPHA® Stencil products are based on unique blends of advanced technology, the experience gained from having made over half a million solder paste stencils, the specialist knowledge that could only be accumulated by a company privileged to produce bo
SNE-4500M Plus The Highest-end Tabletop SEM Cost-effective Table-top SEM with Max. 150,000x of magnification by miniaturizing modules. Able to scan images with high resolution of 5nm by the installation of the variable aperture with ease of us
Technical Library | 2023-07-25 16:42:54.0
Printing solder paste for very small components like .3mm pitch CSP's and 01005 Chip Components is a challenge for the printing process when other larger components like RF shields, SMT Connectors, and large chip or resistor components are also present on the PCB. The smaller components require a stencil thickness typically of 3 mils (75u) to keep the Area Ratio greater than .55 for good paste transfer efficiency. The larger components require either more solder paste height or volume, thus a stencil thickness in the range of 4 to 5 mils (100 to 125u). This paper will explore two stencil solutions to solve this dilemma. The first is a "Two Print Stencil" option where the small component apertures are printed with a thin stencil and the larger components with a thicker stencil with relief pockets for the first print. Successful prints with Keep-Outs as small as 15 mils (400u) will be demonstrated. The second solution is a stencil technology that will provide good paste transfer efficiency for Area Ratio's below .5. In this case a thicker stencil can be utilized to print all components. Paste transfer results for several different stencil types including Laser-Cut Fine Grain stainless steel, Laser-Cut stainless steel with and w/o PTFE Teflon coating, AMTX E-FAB with and w/o PTFE coating for Area Ratios ranging from .4 up to .69.
New Equipment | Fabrication Services
PCB Manufacturing Capabilities Items Fabrication Capabilities Remarks Layer Count 2-28 layers If your PCB order is over 28layers, please contact your customer service for quotation. Material FR-4 94V0/ Alum
ALPHA® TETRABOND™ is the culmination of "frameless" stencil development; an elegantly simple system designed to enhance the rigidity of the foil, making safe mounting and demounting an easier proposition. Innovatively encompassed in a thin, one piece
Used SMT Equipment | AOI / Automated Optical Inspection
This AOI was purchased for $49,995 from Manncorp. The Sherlock AOI is in excellent condition and has under 200 hours of usage. The Sherlock AOI Systems detect a comprehensive range of defects and errors in PCB assembly using the Sherlock PCB ins
Specification： The following data is obtained under ambient temperature of 25 ℃ and humidity of 60% Items Pa
Used SMT Equipment | Screen Printers
MPM Accela Screen printer (2005) Brand: MPM Model: Accela Year: 2005 Serial #: AC02020 Type: Screen printer Machine specifications: Windows XP Operating System Benchmark™ Software SPC Data Collection Closed-Loop Squeegee Head CANo
The XACT 4 automatic screen and stencil printer is specially designed to perform any kind of production demands within the electronic industry, and therefore paying special attention to its universal usage. The XACT 4 features the exceptional EKRA ea
PI Series is a new generation 3D Solder Paste Inspection system that overcomes the limitations of traditional SPIs and satisfy all your inspection needs. The PI Series allows to easily implement Solder Paste Inspection in any PCBA line. These new ge
