Electronics Forum | Tue Nov 18 07:22:56 EST 2008 | wewilldoit
Hi folks! TI told us that we are the only one with the following problem... We discovered a really bad wetting characteristic of some SMD ICs from BurrBrown. At the moment: XTR106 / INA118 / ADS7844. After the reflow process we found out that this pa
Electronics Forum | Wed Nov 26 13:31:40 EST 2008 | stepheniii
I don't know why they use it. I just know I read a TI white paper that said the problem wasn't their fault even though they knew that paladium made the parts hard to solder. And once when I started a new job one of the guys said that the owner had
Electronics Forum | Wed Nov 02 11:01:56 EDT 2022 | tommy_magyar
Ellaborating on Evtimov's answer: - solder paste type, think about solder granulation and viscosity. Both of these will directly affect print quality if wrong print parameters used. You will normally find recommended print parameters on the solder pa
Electronics Forum | Thu Oct 27 06:05:50 EDT 2022 | angela t
SMT chip processing short-circuit bad phenomenon mostly in the fine pitch IC pins, mostly in the 0.5mm and the following pitch between the IC pins, because its spacing is small, improperly designed template or printing a slight omission is very easy
Electronics Forum | Thu Oct 27 20:46:35 EDT 2022 | emeto
Also solder paste type, optimized printer parameters suitable for this paste, correct apertures design on the stencil, stencil thickness, proper AAR, mounting accuracy and placement profile, oven profile, board thickness and a few other.
Electronics Forum | Mon Jul 16 21:29:03 EDT 2001 | davef
Cleaning RMA with water is bad news. It will turn your solder connections white and remove none of the RMA residues. There was a thread on removing RMA within the past two weeks on SMTnet. Check the fine SMTnet Archives. Additionally, look at M
Electronics Forum | Fri Jun 12 07:14:36 EDT 2015 | gabinocf
Thanks by your response, at this moment I have problems in a Lead Free process the issues that i have are solder peaks, by my understanding this conditions is due to lack of flux, bad temperature profile or the dwell time is too long. My concern is,
Electronics Forum | Mon Jul 16 21:25:26 EDT 2001 | davef
Sure, use of U-shape apertures is another way to reduce the amount of paste that you apply. That and similar schemes mentioned in the article are not a function of the flux used. We have used U-shaped apertures for MELF and mini-MELF. They are sug
Electronics Forum | Tue Jun 04 20:34:28 EDT 2002 | russ
Jason, Excessive thermal ramp rates, misprints, improper pad design, paste type, placement pressure, all can cause solderballs. Do the pads on this board meet IPC 782 criterias? I have found that too much pad underneath component can cause this. A
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