Industry News: bake and heatsink (Page 2 of 3)

ECD Soldering Seminar Will Help Improve Yields, Reduce Re-work and Increase Profitability!

Industry News | 2001-08-02 16:39:57.0

Mr. Ray Chartrand, one of the leading experts in the Soldering Industry, in concert with ECD will be holding a series of cost-saving Profiling Seminar during August 2001. Ray has over 20 years experience troubleshooting soldering, reflow, and cleaning problems for the electronics industry and presently consults for over 40 of the largest industries in the electronic assembly marketplace.

Electronic Controls Design Inc. (ECD)

Seika Machinery to Demo New Rework and Conformal Coating Systems at APEX

Industry News | 2015-01-22 11:58:02.0

Seika Machinery will debut the RD-500V Rework Station from DEN-ON INSTRUMENTS CO., LTD. in Booth #3701 at the IPC APEX EXPO, scheduled to take place Feb. 24-26, 2015 at the San Diego Convention Center in California. The all-in-one advanced technology SMT rework station is compatible with all kinds of rework and SMT component types, including 01005s.

Seika Machinery, Inc.

BTU and ECD Win the EM Asia Innovation Award for the New Recipe Pro

Industry News | 2016-04-29 12:15:21.0

BTU International announces that it has been awarded a 2016 EM Asia Innovation Award in the category of Software – Process Control for its RecipePro recipe generator software. The award was presented to the company during an April 27, 2016, ceremony at the Shanghai World Expo Exhibition & Convention Center during NEPCON China. The new Recipe Pro recipe generator software was jointly developed with Electronic Controls Design Inc. (ECD).

BTU International

Seika to highlight the latest equipment from McDry, Unitech, Sawa and MALCOM at SMTA Guadalajara

Industry News | 2018-10-15 18:45:29.0

Seika Machinery today announced plans to exhibit at the SMTA Guadalajara Expo & Tech Forum, scheduled to take place November 14-15, 2018 at the Expo Guadalajara. Seika will discuss the latest equipment from McDry, Unitech, Sawa and MALCOM.

Seika Machinery, Inc.

Parvus Announces Availability of Four Rugged Celeron-based Embedded Computers: SpacePC 1450, 1451, 1453, and 1850

Industry News | 2005-04-20 13:21:59.0

New PC/104-Plus SpacePC CPUs combine fanless -40C to +85C extended temperature operation with 256MB of soldered RAM for high reliability in mobile computing applications

Parvus Corporation

Indium Corporation to Showcase Proven EV Products and High-Reliability Alloys at productronica China

Industry News | 2023-04-03 13:55:05.0

Indium Corporation® is proud to showcase its innovative products and expertise for the rapidly evolving electric vehicle manufacturing and e-Mobility market, including cutting-edge high-reliability alloys, at productronica China, April 13-15, in Shanghai.

Indium Corporation

Indium Corporation to Feature Solutions for Thermal Management and Advanced Packaging at IMAPS Symposium

Industry News | 2023-09-25 20:04:34.0

Indium Corporation® will proudly feature an array of innovative materials solutions for thermal management and advanced packaging applications at the IMAPS International Symposium on Microelectronics, October 3-4, in San Diego, California.

Indium Corporation

Seika Machinery to Showcase World Renowned Storage Cases and Equipment at the IPC APEX EXPO

Industry News | 2013-01-16 13:59:39.0

Seika Machinery, Inc., will showcase its proven, advanced machinery in booth #2727 at the upcoming IPC APEX EXPO

Seika Machinery, Inc.

BTU and ECD Partner to Develop a Comprehensive Recipe Prediction Tool

Industry News | 2015-11-18 18:44:38.0

BTU International today announced that it has partnered with thermal measurement innovator ECD in a joint development initiative to integrate the company’s new Recipe Generator technology directly into BTU’s Wincon furnace operating system. ECD’s Recipe Generator is currently available through ECD’s M.O.L.E. series of thermal profiling systems, and the new integrated feature will be released in early 2016 as part of BTU’s Pyramax reflow product line. The technology will be the industry’s most comprehensive recipe prediction tool to-date, due to its process settings for zone temperatures and belt speed, which take into account the convection rate -- the most significant element of heat transfer.

BTU International

How to Prevent Solder Ball and Bridging Defects during the SMT Reflow Process

Industry News | 2018-10-18 08:32:52.0

How to Prevent Solder Ball and Bridging Defects during the SMT Reflow Process

Flason Electronic Co.,limited


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