Technical Library | 2022-10-11 20:15:14.0
The increased temperatures associated with Pb-free processes have produced significant challenges for PWB laminates. Newly developed laminates have different curing processes, are commonly filled with ceramic particles or micro-clays and can have higher Tg values. These changes which are aimed at improving the materials resistance to thermal excursions and maintaining electrical integrity through primary attach and rework operations have also had the effect of producing harder resin systems with lower fracture toughness.
Industry News | 2012-11-29 13:46:02.0
In October, Universal Instruments Corporation’s Advanced Process Lab (APL) held its third Advanced Research in Electronics Assembly (AREA) Consortium meeting of 2012 at Binghamton University’s Innovative Technologies Complex in Vestal, N.Y. The 25-member consortium, organized by Universal, helps member organizations identify and develop new and emerging technologies, generating applicable knowledge for specific product development and manufacturing processes.
Industry News | 2010-09-27 23:15:26.0
VJ Technologies, Inc., the leader in rework technologies and global provider of advanced X-ray inspection systems, announces that Intel’s James Wade and Raiyo Aspandiar, along with VJ Technologies’ Donald Naugler and Terry Leahy will present a paper titled “PCB Pad Site Dress Methods on BGA and Socket Pad Arrays” at the upcoming SMTA International, scheduled to take place October 24 - 28, 2010 at the Walt Disney World Swan and Dolphin Resort in Orlando, FL.
Industry News | 2010-07-29 15:10:06.0
Universal Instruments’ Advanced Process Lab hosted the first Advanced Research in Electronics Assembly (AREA) Consortium meeting of 2010 at the Treadway Inn in Owego, NY on June 16-17. Nearly 80 attendees from the 29 member companies participated in the two-day event, which will also be presented in subsequent webcasts. Topics ranged from thermal interface assembly to a continuing analysis of lead-free solder microstructure and reliability.
Electronics Forum | Wed Jul 01 04:54:28 EDT 2015 | jvercamm
hi, the last post on pad cratering dates from 2012. We have (likely similar) problems with a RoHS 783 solder ball BGA size 29x29mm^2 (organic package BT), pitch is 1mm and solder ball diam is 0.5mm the field failure is after 12 months, almost exclu
Electronics Forum | Mon Jul 23 14:39:11 EDT 2012 | hegemon
I would think that wave solder beneath a BGA component might be a little bit stressful. The board will be expanding much faster than the BGA on the topside. This will cause some stress to the solder joints that might show up as the failure you are
Electronics Forum | Mon Jul 23 05:40:58 EDT 2012 | franks
We are having a problem with a 601 pin BGA in that the corners of the BGA are lifting and taking the pads with them. Faults are not always seen straight away so we are not sure at which point the fault is happening. So far it looks as though flexing
Electronics Forum | Fri Jun 05 17:36:39 EDT 2009 | gsala
what do you think about Moisture entrapped into BGA or PCB before reflow ? regards GSx
Electronics Forum | Fri Jun 05 16:06:51 EDT 2009 | mjz289
This is from a section of an ALtera EP2SGX130-5 STRATIX 2 leadfree 1,508 ball BGA. What can be causing this? It is from an unused board (not assembled in a unit, or in the field, but it did pass electrical and function test. There are three of them i
Electronics Forum | Sun Jun 07 09:01:47 EDT 2009 | davef
IPC T-50, Revision H, Terms and Definitions for Interconnecting and Packaging Electronic Circuits, 96.2176 Pad Cratering. A separation of the pad from the printed board resin/weave composite or within the composite immediately adjacent to the pad as
