Electronics Forum | Mon Jun 18 18:17:10 EDT 2001 | davef
What to you consider to be the minimum resolution [micron] for: General, BGA, die attach uBGA, flipchip, wire bonds Wire cracks, delamination Microcircuit failure What is the relationship between resolution [micron] and the kV of the tube?
Electronics Forum | Fri Jun 16 18:48:57 EDT 2006 | GS
Hi Grant, just my opinion, I think the concern could be related to the extra temperature the BGAs have been exposed during the Lead Free Reflow Temperature. So you need to check ( data sheet) what is the max temperature and how long the Pb/BGA can w
Electronics Forum | Tue May 20 17:09:13 EDT 2008 | davef
Sorry, we didn't do a good job of understanding your question. For more on delamination, look here: http://www.smtnet.com/Forums/Index.cfm?CFApp=1&Message_ID=54655 ... but we're not so sure that this is a straight delamination issue, because: * One
Electronics Forum | Thu Feb 04 09:22:56 EST 1999 | Terry Burnette
| Hello all, | | Are BGA's easy to develope shorts? If a process is stable and all of a sudden you get BGA's shorting out on you, what might be problems? | | We've checked our solder paste amount, and we've rechecked our reflow profiles and nothin
Electronics Forum | Mon Aug 21 12:08:36 EDT 2000 | Dason C
Hi! I had experience with my customer complain about the delamination on BGA. The first question, I will ask my customer how they removed the parts and de-cap (my customer is using de-cap instead of SEM, I prefer SEM). Most of the customer which I
Electronics Forum | Fri Mar 30 14:47:27 EDT 2007 | GS
MSL 3) By SAM (Scanning Acoustic Microscope) before to remove them from PCB, you could identify if de-laminated or not and the degree of delamination. Best Regards...GS
Electronics Forum | Fri Jul 21 14:36:52 EDT 2006 | amol_kane
could also be a component issue...delamination/popcorning of the component....what is the MSL level?
Electronics Forum | Tue Oct 23 20:27:06 EDT 2001 | davef
WOW!!! How do people get these coo toys? Comments are: * IPC-7530 is not a specification. It is merely a guideline. [IPC-7530 �Guidelines for Temperature Profiling for Mass Soldering (Reflow and Wave)�] * What makes you say a 20-micron intermetall
Electronics Forum | Wed Oct 24 11:14:44 EDT 2001 | Cemal Basaran
Dave; Thanks for responsding so fast. here are my answers. 1-WOW!!! How do people get these cool toys? I am with the University at Buffalo Electronic Packaging Lab. http://www.packaging.buffalo.edu We have pretty much everything that is sold on the
Electronics Forum | Mon Aug 14 18:03:49 EDT 2006 | GS
Sure the bake need to be done after BGA replacement? Normally the board need to be backed before BGA replacement (not only)in order to avoid PCB delamination due to moisture entrapped during his life staing on field. Oven Temperature from 90 to 125
