Electronics Forum | Mon Jun 15 16:31:25 EDT 2020 | rgduval
You may find some wetting issues running LF HASL with 63/37, as your reflow temperatures will be significantly below the LF reflow. On fiducials...if you don't have a quote for your boards with ENIG, I would recommend at least checking it out. It's
Electronics Forum | Mon Oct 22 05:04:08 EDT 2007 | jkhiew
Hi, Recently we have encountered solder wicking on components termination (total of 13 pcs of components on one pcb)with Ag/Pd finishes during lead-free reflow soldering. The pcb is LF HASL surface finish and LF solder paste composition is SAC305.We
Electronics Forum | Wed Oct 05 15:31:44 EDT 2005 | chunks
Thanks Amol, You brought up some good ideas that we'll use. Has anyone ever heard of under filling the BGA (after reflow) with a material that cures, then thermal removing the BGA to check the acual size of the ball to pad?
Electronics Forum | Thu Dec 11 11:59:23 EST 2008 | joeherz
Update - We've tested a board previously having voiding issues with ENIG versions and the voiding has completely disappeared. No other variables were changed. Looks promising. I have an order of LF HASL boards arriving soon that we plan to split i
Electronics Forum | Fri Feb 13 19:51:07 EST 2009 | joeherz
Update Received cross-section analysis for ENIG plated boards and am happy to report that we have no voiding issues. Intermetalics look great and no copper dissolution. No process parameters were changed, only the PCB plating. For now, we are onl
Electronics Forum | Thu Apr 20 02:27:11 EDT 2017 | pavel_murtishev
Mile, Please tell me more about your soldering process: - Are soldering process parameters the same for all three pins? - Is unsoldered pin connected to thermal heavy copper polygon? - What is your board surface finish? HASL? - Sn/Pb or LF process?
Electronics Forum | Wed Aug 25 09:55:16 EDT 2010 | mikesewell
Have the huge LF BGA reballed to leaded and assemble it with your leaded process. Time savings from using the rework station should pay for the reball if you're doing more than just a few.
Electronics Forum | Mon May 25 08:37:28 EDT 2009 | d0min0
Hello, recently we changed supplier of the LF BGA, we did corossection and now have doubts... previous BGA specs : pitch 1mm, ball diameter 0.6mm future BGA specs : pitch 1mm, ball diameter 0.4mm on the crossecrion we found that one of the ball seem
Electronics Forum | Thu May 25 05:22:51 EDT 2006 | aj
Guys, We have an issue with a Board we are running at the moment. We have 3 BGAs on the board 1 Leadfree and 2 are not. We are running a Leaded Process and the LF part is not available Leaded. What do we do? I reckon that all we can do is try an
Electronics Forum | Wed Dec 22 08:49:55 EST 2004 | markhoch
I'm looking for some data to support my argument that HASL boards are not the most ideal boards for manufacturing involving BGA's and 0402's. I'm sure one of you SMT Gurus out there can point me in the right direction! Thank you in advance!
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