Electronics Forum | Tue May 12 10:03:12 EDT 2009 | daan_terstegge
Hi All, I see more and more components like QFN or LGA with bottom-only terminations,with landpatterns getting finer all the time. I have no ppm-figures of our process, but based on a benchmark study by Agilent I'd say that 500 ppm is a decent value
Electronics Forum | Tue Jul 09 15:20:19 EDT 2002 | pjc
When you look at the capabilities of Combo machines they tend to sacrifice performance when compared to separate X-ray and AOI machines, meaning they don't do either the X-ray or AOI operations as well as a machine that was designed to do only one. A
Electronics Forum | Thu Jul 11 17:26:27 EDT 2002 | Tony B
Does anyone know how the Fuji IP2 can be adapted to place BGA's? The MTU places the chip on a carrier with suction in the center and it will not hold on to the BGA due to the lack of a flat surface on the bottom. I have had limited success building
Electronics Forum | Tue Jan 16 07:59:36 EST 2007 | tk380514
we worked out that the wave soldering cassettes Duratstone material takes alomst 35 degree away from the surface of the pcb, and the speed is already too slow it should be over 1.0 - 1.8 meters a minute but its now already 82 cm a minute, in order to
Electronics Forum | Mon Jun 12 14:33:40 EDT 2006 | pjc
IPC spec is V-score shall not be more than 1/2 board thickness. They should be V scoring 1/4 off top and 1/4 off bottom equally.
Electronics Forum | Thu Jan 15 12:55:03 EST 2004 | James
Polarity in tape and reel is usually always on the bottom left side. And that is correct for the trays, they have a corner taken out where the polarity goes. Hope that helps........
Electronics Forum | Mon Jul 17 13:36:55 EDT 2006 | kjeffries
I appreciate your comments regarding the programmability of the Mirtec. What type of SMT machine do you use? How easy have you found it to transfer the SMT profiles to the Mirtec? How do you rate the Mirtec in handling top/bottom, multi-panel asse
Electronics Forum | Fri Feb 22 13:55:27 EST 2019 | bruce_mackean
Is there a need for a simple application to merge a bill of material with the xy placement data into a single (or top/bottom) files for machine programming? ie. add a part number column to the xy data, including "N/A" for parts not found in the BoM?
Electronics Forum | Wed Jun 24 16:23:29 EDT 1998 | Justin Medernach
| Has anyone had experience with placing BGA on gold plated boards. I thought I read a while ago there was a problem with embrittlment causing cracked joints. If anyone has experience with this your feedback would be great. | Mike Mike, Your concer
Electronics Forum | Thu Jun 25 09:53:04 EDT 1998 | Earl Moon
| | Has anyone had experience with placing BGA on gold plated boards. I thought I read a while ago there was a problem with embrittlment causing cracked joints. If anyone has experience with this your feedback would be great. | | Mike | Mike, | You
