1st Place Machinery Inc. | http://www.firstplacemachinery.com/smt_pcb_test_xray_yestech.html
YesTech YesTech YTX 3000 Xray Machine Model Number: HXR-3000 Serial Number: X30604395 Year 2006 Type: High Resolution Xray Inspection System High Perfromance - Manitenance Free - Cost Effective * BGA / Flip Chip
1st Place Machinery Inc. | http://www.firstplacemachinery.com/firstplace_cr_technology_crx2000_xray.html
CR Technology CRX 2000 CR Technology CRX2000 Xray Equipment Description CR Technology Model Number: CRX2000 Serial Number: 1S1878.0100 Year 2000-2001 Hamamatsu Tube Type -130kV X-Y-Z indexing table with joystick control 18" x 24" X-Y travel Full 360 degrees rotation and tilt up to 90 degrees BGA / Flip Chip Solder joint quality
1st Place Machinery Inc. | http://www.firstplacemachinery.com/firstplace_yestech_ytx3000_xray.html
) Variable zoom magnification to 120x Full 360 degrees of rotation *BGA / Flip Chip * Solder joint quality * Voids * Bond wires * Electronic and Sealed Assemblies
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/sonoscan-applications/microelectronics
delaminations, cracks and voids within a microelectronic application can lead to catastrophic failure of the device. Sonoscan's Acoustic Micro Imaging has always been the most trusted technology for nondestructive inspection of microelectronics
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes
0147 PQFP Die Cracks 0148 PQFP Die Attach 0202 PBGA 3D Acoustic Microscope Image 0206 PBGA 3D Cross-Sectioned Voids in Molding Compound 0210 PBGA 3D Sectioned Voids in Molding Compound 0245 PBGA
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/industries/automotive-and-transportation?con=t&page=3
Bonded Wafer Delaminations and Voids - Application Note 419 Patent List Nordson SONOSCAN SONOLAB WELCOMES DAGE X-RAY TOOL Nordson SONOSCAN C-SAM AND Q-BAM Nordson SONOSCAN Plastic BGA - Q-BAM acoustic
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/industries/electronics-assembly-and-packaging?con=t&page=5
: Electronics - Assembly and Packaging IRREGULARITIES AND VOIDS Nordson SONOSCAN Microfluidics Channel Defects - Application Note 2158 VOIDS AND DELAMINATIONS Nordson SONOSCAN Ceramic Chip Capacitor
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/applications/test-and-inspection?con=t&page=6
Voids - Application Note 419 C-SAM AND Q-BAM Nordson SONOSCAN Plastic BGA - Q-BAM acoustic cross-section - Application Note 2614 Automotive Nordson SONOSCAN When a circuit is being used in an
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/industries/lighting-and-led?con=t&page=3
: Lighting and LED IRREGULARITIES AND VOIDS Nordson SONOSCAN Microfluidics Channel Defects - Application Note 2158 AW SERIES C‑SAM® Nordson SONOSCAN The AW Series are advanced high-capacity, high throughput automated wafer C-SAM®
