Electronics Forum | Wed Nov 23 07:30:44 EST 2011 | scottp
Are you stuck with pin transfer for some reason? Screen printing is more repeatable and easier to maintain.
Electronics Forum | Wed Nov 23 07:38:49 EST 2011 | davef
We agree with the points made by ScottE above. Additionally, most printers are not heavily loaded. So, you wouldn't have to buy another machine, give-up floor space, purchase and store peculiar tooling, etc. We think Darby does pin transfer. Maybe h
Electronics Forum | Wed Nov 23 09:38:52 EST 2011 | blnorman
More agreement with screen print adhesives. Back in a former life time we did do pin transfer on one of our product lines. If you had to go with pins, make sure your adhesive rheology is suited for it. Different adhesives are designed for specific
Electronics Forum | Tue Nov 27 06:11:42 EST 2007 | shy
Hi Loco, my PCBA got top side and bottom side and 90% SMT and 10% THP (top side) which need to be cover by wave solder. And that's why i need to go through reflow and wave.
Electronics Forum | Tue Nov 27 07:36:29 EST 2007 | shy
solder the part is for SMT component (located at top side and bottom side) and wave solder is for THP (located at top side only).
Electronics Forum | Sun Dec 02 22:00:21 EST 2007 | shy
The idea for solder at bottom side is for component such as SOIC, QFP and chip. This solder is needed since not entire bottom component had glue. that's why we're combining both solder paste and glue and reflow at the same time.
Electronics Forum | Thu Nov 29 13:26:57 EST 2007 | realchunks
Nope, my thought process ejected from my brain and will have to watch this thread pan out from the side lines. Should be interesting.
Electronics Forum | Thu Nov 29 13:05:46 EST 2007 | stepheniii
I really hate to ask but must. Are the components that are falling off, the components that don't have glue? Seriously not all the parts on the bottom are glued on? How do they stay on during the wave? The normal way is to run the top SMT as normal
Electronics Forum | Fri Nov 30 08:35:51 EST 2007 | stepheniii
We put glue on the bottom of the board that already has the topside SMT mounted. We populate the board. We put it through a cure profile. At this stage the topside components are soldered on. The bottom side components are glued on with NO solder on
Electronics Forum | Thu Nov 29 22:31:27 EST 2007 | shy
Hi Stephen, The component falling off is the component that had glue. the component witout glue is being covered by masking during wave. What is the meaning by populated the part and cure it? is it run with solder paste profile or glue profile or yo
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