Electronics Forum | Fri Feb 13 11:46:23 EST 2004 | Jack
Is your customer trying to reduce voiding? If the device is using Sn90 / Pb10 and the paste is Sn63/Pb37 the board will melt first. However, if both solders are 183C eutectic, it's a tossup? PCB design, copper weight, bga type (pbga, micro bga, Tbg
Electronics Forum | Thu Jun 03 08:03:22 EDT 2004 | vinitverma
You can have a look at Assembleon (formerly PHILIPS EMT) equipment. They have equipment ranging from rated speeds of 6500cph to 150,000cph. I guess their OPAL XII should be the best fit machine in terms of its capability and speed both. It can do fro
Electronics Forum | Tue Aug 22 03:04:07 EDT 2006 | PP
Any help/suggestion is much appreciated I am doing lots of BGA Reworks from a small uBGA with a few balls to a large BGA with over 1500 balls. The reworks have been done on SRT 1100 Series Machine for many years. SRT 1100 Machine is good for the c
Electronics Forum | Fri May 14 09:00:35 EDT 2010 | rafacadiz
I attached a RX picture. A lot of voids and micro balls arround the flux residue. What do you think, relow temperature reflow or OSP poor weeting.? I appreciate your comments. Thanks,
Electronics Forum | Tue Mar 03 02:39:56 EST 2015 | sarason
I would presume you reflow the top of the board first. Use tented vias. As you have worked out, vias have surface tension, which sucks the solder up the hole during reflow of the bottom of the board. Good luck! regards sarason
Electronics Forum | Tue Mar 03 03:11:57 EST 2015 | vb7007
Hi I also forgot to mention, top side is reflowed first at SMT. Tenting vias is good option. we are looking into it. Can you please also suggest any solution to avoid solder balls at bottom side in other places than vias. Thanks
Electronics Forum | Tue Jan 03 03:01:35 EST 2006 | Frank
The 740 and 760 basically have the same specs as far as component ranges: 0402-50mm components. The 760 is a bit more accurate and the vision system is better. The 740 was designed when BGA weren't really around and so it can barely vision center b
Electronics Forum | Mon Mar 02 23:48:22 EST 2015 | vb7007
Hi We are using Universal carrier for a 2 sided PCB, where the bottom side goes for hand solder the switches after wave. Our issue is, we are getting micro solder balls all over PCB bottom after wave, whereas we got numerous vias, which also turns
Electronics Forum | Fri Mar 24 12:16:37 EST 2006 | patrickbruneel
Darn Rob you're brilliant You just solved the dilemma of micro cracks and hot tear in lead free, just add a softer metal like.....and the joints won't crack. You wrote "BTW: Lead is far softer & dissolves far more easily than copper or tin, hence wh
Electronics Forum | Thu Nov 11 20:33:05 EST 1999 | Dave F
Michael: DIGITIZING BOARDS Yech!!! ScanCAD 303.986.7707fax7631 makes a Xerox copier-like thing to copy your board. But why not consider: 1 There are service bureaus that will scan and convert your boards. 2 Why don't you get the gerber data fr
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