Electronics Forum | Mon Nov 07 16:34:55 EST 2005 | CW
If I am putting chip capacitors on a .063 FR4 board, what size package should we stay away from to avoid cracking? If I use 2 mil copper on the outside layers of a PCB, am I limited to what pitch of parts I can use? Specifically, will using 0603
Electronics Forum | Thu Jun 24 11:21:40 EDT 2010 | floydf
Hi, > > I have a 100nF 0805 ceramic cap (the most > common type!), Yageo brand (20+ pcs. on the > module). In our production run I get some errors > due to conductive caps (can be anything from 25 > Ohm to 5K - most are open of course). Only one
Electronics Forum | Mon Nov 07 16:31:47 EST 2005 | CW
hi Bob, Thanks for the info. I understand your comments, but I am looking for specific guidance, If I am putting chip capacitors on a .063 FR4 board, what size package should we stay away from to avoid cracking? (I realize this is dependent on h
Electronics Forum | Tue Sep 10 23:37:22 EDT 2002 | Steve E
Dear Sir I can assure you that I have personal experience with the part in question.This part will run with the recommend vision types ( 11 & 12 ). I noticed You neglected to state how old the machine was, and the amount of hours. The CP-6 series hav
Electronics Forum | Thu Nov 11 10:55:32 EST 1999 | KenF
Hi, could anyone tell me the maximum size of an SMD ceramic capacitor that can be assembled on a copper based substrate reliably? The SMD will be reflowed on the copper substrate. The main concern is the CTE mismatch between the ceramic capacitor and
Electronics Forum | Wed Jun 30 00:20:08 EDT 2010 | leadthree
Thanks for your reply. This production lot is already finished. We produced in 2 lots, first was no-clean (and was ok), 2nd lot was cleaned (aqua based), and I need to look into the cleaning further. Since it's all finished I can't get parts from se
Electronics Forum | Tue Jun 29 14:55:22 EDT 2010 | rgduval
For the capacitors that Yageo analyzed... Were they taken out at representative points in the process?? ie. were samples taken from pre-assembly, pre-ICT, post-conformal coat, post-final test? You note that the parts 'seem' to be ok up to ICT. And
Electronics Forum | Fri Sep 20 20:03:55 EDT 2002 | mjabure
Well chip I ought to leave you guys hanging in the breeze on this one , but here goes. Steve, your assumption that the nozzle is calculated as part of the component body for types 11 & 12 is incorrect. during center test on the 643's one of the par
Electronics Forum | Tue Nov 08 05:00:23 EST 2005 | rlackey
Hi CW, Regarding orientation, yes, your diagram is right - see the following link for confirmation. http://search.murata.co.jp/Ceramy/image/img/A18X/C2EB3C.PDF Regarding information on bending strength you want to talk to your local Murata office
Electronics Forum | Tue Dec 29 03:37:09 EST 1998 | John W
| can some kind of through hole type connector pass through | the smt process (with IR technology)???? | the temperature factor or material factor????? | There's a company called Samtec (web site is www.samtec.com) who can provide these.They have a
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