Electronics Forum | Sat Jun 19 00:49:17 EDT 2010 | mun4o
Hi all, lately ofen I have problem with cracked ceramic capacitors.We use 0805 and 0603 cap. Samsung.ICT measure diferent capacity of nominal.If I tray to desoldering component , then component cracked.I think , that the reason is the moisture in com
Electronics Forum | Thu Apr 10 07:24:56 EDT 2003 | pjc
I had a similar problem with cracked caps. I checked all my processes and finally found that the caps were cracked in the tape. Check the condition of the caps in the tape. This was unique to one mfg.- EPCOS.
Electronics Forum | Thu Apr 10 19:19:01 EDT 2003 | stevemoore
Are you gluing the parts to the board? We had a similar situation where the glue beneath the component would add a 'fulcrum' point to the center of the device and when the board flexed the part would fracture.
Electronics Forum | Fri Apr 11 00:32:17 EDT 2003 | Joe
Hello, Regarding the failures not showing up at ICT. Failed decoupling caps are notoriously difficult to diagnose within ICT. Check with your test engineering folks and ask them how they've coded for these parts. I doubt that they will say those
Electronics Forum | Fri Apr 18 16:53:25 EDT 2003 | takfire
DST, What was the crack signature? Was the crack parallel with the internal electrodes or 45� with the terminal electrode? It is also important to determine the orientation of the failed caps on the PCB (in regards to depaneling). Perhaps the cap
Electronics Forum | Fri Apr 18 19:15:49 EDT 2003 | adlsmt
Please elaborate on "De-paneling method" vs. boards being "snapped out of thier pannel". Read the last post before mine again.
Electronics Forum | Mon Jun 21 07:00:16 EDT 2004 | N.Berkhoudt
May be a little late for you, but we experienced the some problems with decouple 100 nF C's. Siemens has reported problem in production in november 1998.
Electronics Forum | Fri Jun 20 11:05:53 EDT 2003 | russ
Why don't you give us the full process along with your delta T for the wave (final preheat temp to wave contact temp). Don't forget de-paneling, ICT, and other things. It could be from the supplier, but it usually is from excessive placement force
Electronics Forum | Tue Jul 01 11:15:43 EDT 2003 | PH
Are these caps on the bottom side or topside? Bottomside could be the glue dots are too big for the caps your putting down, the glue cures and then the solder is putting force on the edges of the cap causing cracks.. Other than that agree with oth
Electronics Forum | Wed Jul 02 18:39:22 EDT 2003 | Jim Yutzie
The vast majority of issues I have seen are from depaneling with a PCB seperator. Try placing a row of tightly spaced unplated holes adjacent to the edge that the crack parts are being found out (assuming they are within .5" or so of the score line)
