Electronics Forum | Thu Jul 03 07:43:50 EDT 2003 | davef
So, there is a crack or gap between: * Solder and component termination. * Component termination and component body. Correct? Describe: * Coarseness / smoothness of the metal on the termination underneither the crack. * Solder left on the terminatio
Electronics Forum | Fri Oct 18 17:47:37 EDT 2002 | russ
What is the determination of poor soldering fails pull test, non-wetting, visual)? I have never heard of an SMT component that has leads higher than the body of the component. Refer to IPC 782 3.6.1.7 it provide the guidelines for SMT standoff heig
Electronics Forum | Tue May 30 21:06:57 EDT 2000 | Dave F
Thames: Welcome. Consider Rev C. It's current and has "better" descriptions. Consider a course. I believe IPC is doing a tourof A-610 and J-001 classes. Different problems have different root causes. For instance: * Cold solder: Moving the c
Electronics Forum | Mon Feb 18 02:08:06 EST 2008 | lococost
4 days seems a lot. You could be losing flux activation causing poor wetting on the enig. Check your suppliers data sheets for paste life. If it was contamination on the PCB, you'ld expect other components to solder badly as well. Try using a bra
Electronics Forum | Thu Sep 24 10:19:55 EDT 1998 | Dave F
| i am working on a no-clean process implementation project in a company. i want to change a board to no-clean which had dendrite problems underneath the small resistors on the bottom side(in smt).i want more information on the exact cause of dendrit
Electronics Forum | Mon Feb 15 17:57:01 EST 1999 | Earl Moon
| Hope some of you out there can help me with this one. | I am getting feedback from our test department that they are showing opens on solder joints which have visually good wetting. The touch-up operators confirm that the joint looks good. All they
Electronics Forum | Mon Feb 02 05:08:37 EST 2004 | heccles
Anybody seen problems with potted trimpots and reflow soldering - specifically poor wetting as a consequence of lead contamination from the potting compound. Regardless of reflow profile used (MIL -STD -202) cannot get a good joint formed ! If you us
Electronics Forum | Tue Apr 15 21:24:41 EDT 2008 | davef
We find it curious that: * Heat slug pad for Q19 didn't take solder, indicating a pad [board] solderability issue. * Signal termination pads for Q19 didn't flow well, indicating a poor thermal recipe or a pad [board] solderability issue. * Signal ter
Electronics Forum | Sat Sep 26 19:09:17 EDT 1998 | Graham Naisbitt
As an addendum to Daves posting, please consider that: There is no such thing as no residue fluxing. A no-clean must herefore, have benign residues - in other words, they are not as efficient at removing surface oxides to enable good solder joints. S
Electronics Forum | Fri Jul 13 11:33:54 EDT 2007 | realchunks
Just starting and already responsible for product quality and machine adjustment? Wow, you poor bastard. Ok, I will assume this problem happens on the bottom side of the board with a thru-hole IC. The short occurs on the side that doesn't have the
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